公开(公告)号：US20240128168A1

公开(公告)日：2024-04-18

申请号：US17985912

申请日：2022-11-14

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Feng Lee ,  Chen-Hsiao Wang ,  Kai-Kuang Ho

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4821 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49579 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48249 ,  H01L2224/48257 ,  H01L2224/4903 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2924/182

Abstract: A QFN package includes a copper lead frame. The copper lead frame includes a die paddle. A die is fixed on the die pad. A coolant passage is disposed within the die paddle. An inlet passage connects to one end of the coolant passage. An outlet passage connects to another end of the coolant passage. A mold compound encapsulates the copper lead frame and the die.