公开(公告)号：US10656518B2

公开(公告)日：2020-05-19

申请号：US15844617

申请日：2017-12-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Chuang-Tse Wang ,  Fa-Fu Hu

IPC: G03F1/84 ,  G06N3/08 ,  G06N3/04 ,  G03F7/20 ,  H01L21/66 ,  H01L21/67 ,  H01L21/027

Abstract: A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.

公开(公告)号：US20190187555A1

公开(公告)日：2019-06-20

申请号：US15844617

申请日：2017-12-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Chuang-Tse Wang ,  Fa-Fu Hu

IPC: G03F1/84 ,  G06N3/08 ,  G06N3/04 ,  H01L21/027 ,  H01L21/66 ,  H01L21/67 ,  G03F7/20

CPC classification number: G03F1/84 ,  G03F7/20 ,  G03F7/7065 ,  G06N3/04 ,  G06N3/08 ,  H01L21/0274 ,  H01L21/67259 ,  H01L22/12

Abstract: A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.