公开(公告)号：US20160274570A1

公开(公告)日：2016-09-22

申请号：US14660961

申请日：2015-03-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Lian-Hua Shih ,  Ching-Hsing Hsieh ,  Feng-Chi Chung ,  Chia-Chi Chang ,  Yu-Cheng Lin ,  Sian-Jhu Tsai ,  Meng-Chih Chang ,  Yi-Hui Tseng

IPC: G05B19/4097 ,  G05B15/02

CPC classification number: G05B19/41875 ,  G05B2219/32194 ,  G05B2219/37224 ,  Y02P90/22

Abstract: A method of virtual metrology is disclosed. Process data and measurement values corresponding to a workpiece are collected. The process data and the measurement values are used to establish a conjecture model. A theoretical model corresponding to the workpiece and the conjecture model is used to establish another conjecture model. The another conjecture model is used to establish a virtual metrology value. The virtual metrology value is used to predict properties of a subsequently manufactured workpiece.

Abstract translation: 公开了一种虚拟测量方法。 收集与工件对应的工艺数据和测量值。 过程数据和测量值用于建立猜想模型。 使用对应于工件和推测模型的理论模型来建立另一个推测模型。 另一个猜想模型用于建立虚拟计量学值。 虚拟计量值用于预测随后制造的工件的性能。