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公开(公告)号:US09624092B1
公开(公告)日:2017-04-18
申请号:US15010426
申请日:2016-01-29
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Wei-Hua Fang , Kuan-Yu Wang , Her-Yi Tang , Xuan-Rui Chen
CPC classification number: B81C1/00246 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81B2207/07 , B81C1/00801 , B81C2203/0778
Abstract: A semiconductor structure having micro-electro-mechanical system (MEMS) devices is provided. One of the MEMS devices includes a substrate having a first region and a second region; a membrane structure formed in the first region and positioned correspondingly to a cavity of the substrate; a logic device formed in the second region, and electrically connected to the membrane structure; an interconnection structure formed in the second region, and the interconnection structure formed on the substrate and covering the logic device; and an etching stop layer formed in the second region, and the etching stop layer formed on the interconnection structure and including a nitride layer and a carbon-containing layer formed on the nitride layer. Also, a variation in resonant frequencies of the MEMS devices on the entire wafer is less than 10%.