公开(公告)号：US20240264224A1

公开(公告)日：2024-08-08

申请号：US18116272

申请日：2023-03-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Jinn-Horng Lai ,  Yan-Zung Wang ,  Peng-Hsiu Chen ,  Su-Ming Hsieh

IPC: G01R31/28 ,  H01L23/485

CPC classification number: G01R31/2886 ,  H01L23/485

Abstract: A ground-signal-ground (GSG) device structure is provided in the present invention, including two signal pads aligned in a first direction and two ground pads respectively at two sides of each signal pad in a second direction, and two transmission lines between the two signal pads and are connected respectively with said two signal pads, and said two transmission lines extend toward each other in the first direction and connect to a device, wherein the two signal pads and the two transmission lines are only in the level of 7th metal layer or above in back-end-of-line (BEOL) metal layers.

公开(公告)号：US20240243073A1

公开(公告)日：2024-07-18

申请号：US18116812

申请日：2023-03-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Jinn-Horng Lai ,  Yan-Zung Wang ,  Peng-Hsiu Chen ,  Su-Ming Hsieh

IPC: H01L23/552 ,  H01L23/522

CPC classification number: H01L23/552 ,  H01L23/5225 ,  H01L2223/66

Abstract: A radio-frequency (RF) device includes a main device on a substrate, a first port extending along a first direction adjacent to a first side of the main device, a second port extending along the first direction adjacent to a second side of the main device, a first shield structure adjacent to a third side of the main device, a second shield structure adjacent to a fourth side of the main device, a first connecting structure extending along a second direction to connect the first port and the main device, and a second connecting structure extending along the second direction to connect the second port and the main device.