公开(公告)号：US11477892B2

公开(公告)日：2022-10-18

申请号：US17051723

申请日：2019-05-02

申请人： UNIVERSITY OF LIMERICK

发明人： John Harris ,  Jennifer Hennessy ,  Seamus Clifford ,  Mark Southern

IPC分类号： H05K3/04 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42

摘要： A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

公开(公告)号：US20210243899A1

公开(公告)日：2021-08-05

申请号：US17051723

申请日：2019-05-02

申请人： UNIVERSITY OF LIMERICK

发明人： John Harris ,  Jennifer Hennessy ,  Seamus Clifford ,  Mark Southern

IPC分类号： H05K3/04 ,  H05K3/00 ,  H05K3/42 ,  H05K1/16 ,  H05K1/11

摘要： A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

公开(公告)号：US20210114088A1

公开(公告)日：2021-04-22

申请号：US17054117

申请日：2019-05-14

申请人： UNIVERSITY OF LIMERICK

发明人： Jennifer Hennessy ,  John Harris ,  Mark Southern

IPC分类号： B22D17/22 ,  B22C23/00 ,  B29C33/42 ,  B29C45/37

摘要： A method and apparatus for real-time in-mould marking of a moulded or cast form with an identifier in which a configurable marking module (1) with phase change actuators (23) in the form of a multi-layered printed circuit board assembly (1) with a vertical element (33) having a marker (21) is installed in a mould (2), (35), the marker (21) being remotely configurable by a controller to create a unique identifier which is applied to the form in the mould.