公开(公告)号：US11845846B2

公开(公告)日：2023-12-19

申请号：US16642205

申请日：2018-09-04

申请人： University of Limerick

发明人： Kevin Jeremiah O'Sullivan ,  Leonard William O'Sullivan ,  Seamus Clifford ,  Alice Shannon

IPC分类号： C08K3/22 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y70/00 ,  B29C64/106 ,  A61B6/00 ,  A61L31/18 ,  A61L31/02 ,  B33Y70/10 ,  B29K509/02 ,  B29L31/00

CPC分类号： C08K3/22 ,  A61B6/583 ,  A61L31/028 ,  A61L31/18 ,  B29C64/106 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y80/00 ,  B29K2509/02 ,  B29K2995/0011 ,  B29L2031/753 ,  C08K2003/2244 ,  C08K2003/2286 ,  C08K2201/003 ,  C08K2201/011

摘要： A flowable liquid formulation for 3D printing is described. The formulation comprises from 0.1 to 25 wt. % radiopaque particles, wherein at least 50% by weight of the particles have a diameter of at most 100 nm. The formulation further comprises monomeric, oligomeric and/or polymeric precursors adapted for polymerization to form a solidified article. Also described is an article (100) formed by 3D printing, the article (100) comprising a first 3D printed region (110) having a first radiopacity and a second 3D printed region (120) having a second radiopacity, wherein the first radiopacity is greater than the second radiopacity. Also described is a method of forming the article (100).

公开(公告)号：US11477892B2

公开(公告)日：2022-10-18

申请号：US17051723

申请日：2019-05-02

申请人： UNIVERSITY OF LIMERICK

发明人： John Harris ,  Jennifer Hennessy ,  Seamus Clifford ,  Mark Southern

IPC分类号： H05K3/04 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42

摘要： A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

公开(公告)号：US20210243899A1

公开(公告)日：2021-08-05

申请号：US17051723

申请日：2019-05-02

申请人： UNIVERSITY OF LIMERICK

发明人： John Harris ,  Jennifer Hennessy ,  Seamus Clifford ,  Mark Southern

IPC分类号： H05K3/04 ,  H05K3/00 ,  H05K3/42 ,  H05K1/16 ,  H05K1/11

摘要： A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.