公开(公告)号：US20230036239A1

公开(公告)日：2023-02-02

申请号：US17814593

申请日：2022-07-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Jose Mari Casticimo

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

公开(公告)号：US12302657B2

公开(公告)日：2025-05-13

申请号：US17664510

申请日：2022-05-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/31 ,  H10F39/00

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.

公开(公告)号：US12211863B2

公开(公告)日：2025-01-28

申请号：US17394365

申请日：2021-08-04

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Il Kwon Shim ,  Jeffrey Punzalan ,  Emmanuel Espiritu ,  Allan Ilagan ,  Teddy Joaquin Carreon

IPC: H01L27/14 ,  H01L23/00 ,  H01L27/146

Abstract: A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a recessed structure on the second major cover surface. The recessed structure is located above die bond pads on the die to create an elevated space over peak portions of wire bonds on the die bond pads. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed.

公开(公告)号：US20220384505A1

公开(公告)日：2022-12-01

申请号：US17664510

申请日：2022-05-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/31

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.