公开(公告)号：US20230036239A1

公开(公告)日：2023-02-02

申请号：US17814593

申请日：2022-07-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Jose Mari Casticimo

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.