公开(公告)号：US20220037219A1

公开(公告)日：2022-02-03

申请号：US17389294

申请日：2021-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Eakkasit DUMSONG ,  Mike Jayson CANDELARIO ,  Phongsak Sawasdee ,  Jiraphat Charoenratpratoom ,  Paweena PHATTO ,  Maythichai SAITHONG

IPC: H01L23/053 ,  H01L23/00 ,  H01L21/52

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.