公开(公告)号：US20200321273A1

公开(公告)日：2020-10-08

申请号：US16886728

申请日：2020-05-28

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong TAN ,  Wilson Poh Leng ONG ,  Kriangsak Sae LE ,  Saravuth SIRINORAKUL ,  Somsak PHUKRONGHIN ,  Paweena PHATTO

IPC: H01L23/498 ,  H01L23/16 ,  H01L23/31 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56 ,  H01L23/055 ,  H01L23/04 ,  H01L23/24

Abstract: A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

公开(公告)号：US20220037219A1

公开(公告)日：2022-02-03

申请号：US17389294

申请日：2021-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Eakkasit DUMSONG ,  Mike Jayson CANDELARIO ,  Phongsak Sawasdee ,  Jiraphat Charoenratpratoom ,  Paweena PHATTO ,  Maythichai SAITHONG

IPC: H01L23/053 ,  H01L23/00 ,  H01L21/52

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

公开(公告)号：US20190043797A1

公开(公告)日：2019-02-07

申请号：US16056541

申请日：2018-08-07

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong TAN ,  Wilson Poh Leng ONG ,  Kriangsak Sae LE ,  Saravuth SIRINORAKUL ,  Somsak PHUKRONGHIN ,  Paweena PHATTO

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/055 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56

Abstract: An improved method for forming a semiconductor package is disclosed herein. The method includes forming a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate comprises a recess region. A semiconductor die is attached to the die region within the recess region. A dam structure is formed within the recess region. The dam structure surrounds the semiconductor die and extends upward to a height below the first major surface of the package substrate. A liquid encapsulant material is dispensed into the recess region. The liquid encapsulant material is surrounded by the dam structure. The liquid encapsulant extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.