公开(公告)号：US20240003768A1

公开(公告)日：2024-01-04

申请号：US18334402

申请日：2023-06-14

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Paweena Phatto ,  Maythichai Saithong ,  Eakkasit Dumsong ,  Jiraphat Charoenratpratoom

IPC: G01L9/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: G01L9/0045 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48108 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2924/1659 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16151

Abstract: A semiconductor device has a substrate and a first electrical component including a sensing region disposed over the substrate. The sensing region can be responsive to external stimuli, such as pressure. A cover lid is disposed over the first electrical component and extending to the substrate with an opening in the cover lid aligned over the sensing region. A gel material is disposed within the opening of the cover lid to seal the sensing region with respect to an environment condition, such as liquid. A bond wire is coupled between the first electrical component and substrate. An adhesive layer is disposed around a perimeter of the sensing area and the cover lid is bonded to the adhesive layer. A second electrical component is disposed on the substrate and the first electrical component is disposed on the second electrical component.

公开(公告)号：US12230615B2

公开(公告)日：2025-02-18

申请号：US17558592

申请日：2021-12-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jiraphat Charoenratpratoom ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.

公开(公告)号：US11784102B2

公开(公告)日：2023-10-10

申请号：US17389294

申请日：2021-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Eakkasit Dumsong ,  Mike Jayson Candelario ,  Phongsak Sawasdee ,  Jiraphat Charoenratpratoom ,  Paweena Phatto ,  Maythichai Saithong

IPC: H01L23/053 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/053 ,  H01L21/52 ,  H01L23/564

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

公开(公告)号：US20220208746A1

公开(公告)日：2022-06-30

申请号：US17558592

申请日：2021-12-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jiraphat Charoenratpratoom ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L25/16 ,  H01L23/495 ,  H01L23/00

Abstract: An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.

公开(公告)号：US20220037219A1

公开(公告)日：2022-02-03

申请号：US17389294

申请日：2021-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Eakkasit DUMSONG ,  Mike Jayson CANDELARIO ,  Phongsak Sawasdee ,  Jiraphat Charoenratpratoom ,  Paweena PHATTO ,  Maythichai SAITHONG

IPC: H01L23/053 ,  H01L23/00 ,  H01L21/52

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.