公开(公告)号：US11784102B2

公开(公告)日：2023-10-10

申请号：US17389294

申请日：2021-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Eakkasit Dumsong ,  Mike Jayson Candelario ,  Phongsak Sawasdee ,  Jiraphat Charoenratpratoom ,  Paweena Phatto ,  Maythichai Saithong

IPC: H01L23/053 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/053 ,  H01L21/52 ,  H01L23/564

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.