公开(公告)号：US20220077019A1

公开(公告)日：2022-03-10

申请号：US17444611

申请日：2021-08-06

申请人： UTAC Headquarters Pte. Ltd.

发明人： Saravuth Sirinorakul ,  Preecha Joymak ,  Natawat Kasikornrungroj ,  Wasu Aingkaew ,  Kawin Saiubol ,  Thanawat Jaengkrajarng

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00

摘要： A semiconductor device has a semiconductor die with a sensor and a cavity formed into a first surface of the semiconductor die to provide access to the sensor. A protective layer is formed on the first surface of the semiconductor die around the cavity. An encapsulant is deposited around the semiconductor die. The protective layer blocks the encapsulant from entering the cavity. With the cavity clear of encapsulant, liquid or gas has unobstructed entry into cavity during operation of the semiconductor die. The clear entry for the cavity provides reliable sensor detection and measurement. The semiconductor die is disposed over a leadframe. The semiconductor die has a sensor. The protective layer can be a film. The protective layer can have a beveled surface. A surface of the leadframe can be exposed from the encapsulant. A second surface of the semiconductor die can be exposed from the encapsulant.

公开(公告)号：US11804416B2

公开(公告)日：2023-10-31

申请号：US17444611

申请日：2021-08-06

申请人： UTAC Headquarters Pte. Ltd.

发明人： Saravuth Sirinorakul ,  Preecha Joymak ,  Natawat Kasikornrungroj ,  Wasu Aingkaew ,  Kawin Saiubol ,  Thanawat Jaengkrajarng

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/3185 ,  H01L21/565 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32155 ,  H01L2924/10157

摘要： A semiconductor device has a semiconductor die with a sensor and a cavity formed into a first surface of the semiconductor die to provide access to the sensor. A protective layer is formed on the first surface of the semiconductor die around the cavity. An encapsulant is deposited around the semiconductor die. The protective layer blocks the encapsulant from entering the cavity. With the cavity clear of encapsulant, liquid or gas has unobstructed entry into cavity during operation of the semiconductor die. The clear entry for the cavity provides reliable sensor detection and measurement. The semiconductor die is disposed over a leadframe. The semiconductor die has a sensor. The protective layer can be a film. The protective layer can have a beveled surface. A surface of the leadframe can be exposed from the encapsulant. A second surface of the semiconductor die can be exposed from the encapsulant.

公开(公告)号：US20220208686A1

公开(公告)日：2022-06-30

申请号：US17643244

申请日：2021-12-08

申请人： UTAC Headquarters Pte. Ltd.

发明人： Natawat Kasikornrungroj ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC分类号： H01L23/538 ,  H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

摘要： A semiconductor device has a leadframe and a first electrical component including a first surface disposed on the leadframe. A first clip bond is disposed over a second surface of the first electrical component. The first clip bond extends vertically through the semiconductor device. The first clip bond has a vertical member, horizontal member connected to the vertical member, die contact integrated with the horizontal member, and clip foot extending from the vertical member. A second electrical component has a first surface disposed on the first clip bond. A second clip bond is disposed over a second surface of the second electrical component opposite the first surface of the second electrical component. An encapsulant is deposited around the first electrical component and first clip bond. A second electrical component is disposed over the encapsulant. The clip foot is exposed from the encapsulant.