公开(公告)号：US20220208686A1

公开(公告)日：2022-06-30

申请号：US17643244

申请日：2021-12-08

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Natawat Kasikornrungroj ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L23/538 ,  H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device has a leadframe and a first electrical component including a first surface disposed on the leadframe. A first clip bond is disposed over a second surface of the first electrical component. The first clip bond extends vertically through the semiconductor device. The first clip bond has a vertical member, horizontal member connected to the vertical member, die contact integrated with the horizontal member, and clip foot extending from the vertical member. A second electrical component has a first surface disposed on the first clip bond. A second clip bond is disposed over a second surface of the second electrical component opposite the first surface of the second electrical component. An encapsulant is deposited around the first electrical component and first clip bond. A second electrical component is disposed over the encapsulant. The clip foot is exposed from the encapsulant.

公开(公告)号：US12293972B2

公开(公告)日：2025-05-06

申请号：US17643244

申请日：2021-12-08

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Natawat Kasikornrungroj ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device has a leadframe and a first electrical component including a first surface disposed on the leadframe. A first clip bond is disposed over a second surface of the first electrical component. The first clip bond extends vertically through the semiconductor device. The first clip bond has a vertical member, horizontal member connected to the vertical member, die contact integrated with the horizontal member, and clip foot extending from the vertical member. A second electrical component has a first surface disposed on the first clip bond. A second clip bond is disposed over a second surface of the second electrical component opposite the first surface of the second electrical component. An encapsulant is deposited around the first electrical component and first clip bond. A second electrical component is disposed over the encapsulant. The clip foot is exposed from the encapsulant.

公开(公告)号：US12230615B2

公开(公告)日：2025-02-18

申请号：US17558592

申请日：2021-12-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jiraphat Charoenratpratoom ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.

公开(公告)号：US20220208746A1

公开(公告)日：2022-06-30

申请号：US17558592

申请日：2021-12-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jiraphat Charoenratpratoom ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L25/16 ,  H01L23/495 ,  H01L23/00

Abstract: An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.