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1.发明公开公开(公告)号：US20230303431A1
公开(公告)日：2023-09-28
申请号：US18119407
申请日：2023-03-09
申请人： UTI INC.
发明人： Kukhyun SUNWOO , Hak Chul KIM , Hee Jun AHN , Joo Seok LEE , Min Gyou SEO
CPC分类号： C03C17/32 , G02B1/14 , G02B1/18 , C03C23/007 , G06F1/1652
摘要： A method of manufacturing a reinforced cover window and a reinforced cover window manufactured thereby are proposed. The method includes a first step of forming a TPI layer on a base substrate, a second step of separating the TPI layer from the base substrate, a third step of forming an adhesive buffer layer on a glass substrate, and a fourth step of stacking the TPI layer on the adhesive buffer layer. This secures the TPI's unique pencil hardness of 4H to 6H while maintaining the unique aesthetic sense and touch feeling of the glass.
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公开(公告)号：US20230269896A1
公开(公告)日：2023-08-24
申请号：US18107413
申请日：2023-02-08
申请人： UTI INC.
发明人： Kukhyun SUNWOO , Tea Joo HA , Hee Jun AHN , Seok Pil JIN , Jae Suk OH , Joo Seok LEE
CPC分类号： H05K5/03 , B32B27/281 , B32B17/1055 , B32B7/12 , B32B17/10027 , B32B2250/40 , B32B2255/10 , B32B27/36
摘要： Proposed are a hybrid flexible cover window and a method of manufacturing the same. The hybrid flexible cover window includes a flat portion formed on a flat area of a flexible display and a folding portion which is formed in succession to the flat portion and formed in a folding area of the flexible display. The hybrid flexible cover window includes a substrate, a transparent polyimide layer formed on the glass substrate, and an adhesive buffer layer formed between the glass substrate and the TPI layer, in which the TPI layer has a UV cut-off wavelength of less than 380 nm.
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