利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.029 秒)

    OLED ILLUMINANT FOR A LAMP
    1.
    发明申请
    OLED ILLUMINANT FOR A LAMP 审中-公开
    OLED照明灯

    公开(公告)号：US20140104857A1

    公开(公告)日：2014-04-17

    申请号：US13880156

    申请日：2011-10-18

    申请人： Ulrich Spintge ,  Karsten Diekmann ,  Britta Göötz ,  Steven Rossbach ,  Tom Munters ,  Vincent Johannes Jacobus Van Montfort

    发明人： Ulrich Spintge ,  Karsten Diekmann ,  Britta Göötz ,  Steven Rossbach ,  Tom Munters ,  Vincent Johannes Jacobus Van Montfort

    IPC分类号： F21V21/002

    CPC分类号： F21V21/002 ,  F21K9/00 ,  F21S2/005 ,  F21S8/033 ,  F21S8/04 ,  F21V21/02 ,  F21V23/06 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  Y02B20/36

    摘要： The invention relates to an illuminant (23) and a socket (20) for a lamp (15). The features of the socket (20) can be implemented also independently of the features of the illuminant (23). The illuminant (23) has a preferably planar illumination surface (24). One or more semiconductor lighting elements are arranged within an illuminant housing (30). The illuminant connection device (70) required for mechanical and electrical connection to the socket (20) is provided on the rear face (66) of the illuminant (23), said rear face (66) lying opposite the illumination surface (24). The dimensions of the illuminant are preferably greater than the dimensions of the socket (10) such that the illuminant (23) fully covers the socket when looking onto the illumination surface (24), resulting in a particularly appealing look. Said socket and illuminant (23) modularly achieve large total illumination surfaces in a lamp (15) and an appealing overall appearance in a very simple manner.

    摘要翻译： 本发明涉及一种用于灯（15）的发光体（23）和插座（20）。 插座（20）的特征也可以独立于发光体（23）的特征来实现。 光源（23）具有优选的平面照明表面（24）。 一个或多个半导体照明元件布置在发光体外壳（30）内。 与发光体（23）的后表面（66）相比，设置与插座（20）机电连接所需的光源连接装置（70），所述背面（66）与照明面（24）相对。 光源的尺寸优选地大于插座（10）的尺寸，使得当观察照明表面（24）时，发光体（23）完全覆盖插座，导致特别吸引人的外观。 所述插座和发光体（23）以非常简单的方式模块化地实现灯（15）中的大的总照明面和吸引人的整体外观。

    Optoelectronic Semiconductor Component and Method for Fabricating an Optoelectronic Semiconductor Component
    4.
    发明申请
    Optoelectronic Semiconductor Component and Method for Fabricating an Optoelectronic Semiconductor Component 审中-公开

    公开(公告)号：US20180261648A1

    公开(公告)日：2018-09-13

    申请号：US15533025

    申请日：2015-12-02

    申请人： Britta Göötz ,  Walter Wegleiter ,  Stefan Grötsch

    发明人： Britta Göötz ,  Walter Wegleiter ,  Stefan Grötsch

    IPC分类号： H01L27/15 ,  H01L33/50 ,  H01L33/60 ,  H01L25/16 ,  H01L33/08 ,  H01L33/38

    CPC分类号： H01L27/156 ,  H01L25/167 ,  H01L33/08 ,  H01L33/382 ,  H01L33/505 ,  H01L33/60

    摘要： An optoelectronic semiconductor component is specified that has a semiconductor chip having a main side, the main side comprising a plurality of emission fields that are arranged next to one another. The emission fields are individually and independently actuatable and, during operation, they are each used to couple radiation out of the semiconductor chip. The main side has reflective partitions mounted on it that are arranged between adjacent emission fields and at least partially surround the emission fields in a plan view of the main side. In addition, the main side has a conversion element mounted on it, having an underside, which faces the semiconductor chip, and an averted top. The partitions are formed from a different material from the semiconductor material of the semiconductor chip and jut out from the semiconductor chip in a direction away from the main side. The conversion element covers at least one emission field at least partially and is connected to said emission field in a mechanically robust fashion. The underside of the conversion element in the region of the covered emission field juts out from the partitions in a direction away from the main side by no more than 10% of the height of the partitions.