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公开(公告)号:US10580499B2
公开(公告)日:2020-03-03
申请号:US15710851
申请日:2017-09-21
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hsin-Pang Lu , Chi-Hsiu Hsu , Chung-Hao Chen , Ya-Nan Mou , Chung-Cheng Tsai
Abstract: A read only memory (ROM) is provided in the present invention, which includes a plurality of bit lines extending in a first direction, a plurality of source lines extending in parallel to the plurality of bit lines, and a plurality of word lines extending in a second direction perpendicular to the first direction. Each two ROM cells share an active area and are electrically coupled to one of the plurality of source lines by a common source line contact.
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公开(公告)号:US20240071535A1
公开(公告)日:2024-02-29
申请号:US17966881
申请日:2022-10-16
Applicant: United Microelectronics Corp.
Inventor: Chung-Hao Chen , Chi-Hsiu Hsu , Chi-Fa Lien , Ying-Ting Lin , Cheng-Hsiao Lai , Ya-Nan Mou
CPC classification number: G11C17/16 , G11C16/0433 , G11C16/24
Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
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公开(公告)号:US12237027B2
公开(公告)日:2025-02-25
申请号:US17966881
申请日:2022-10-16
Applicant: United Microelectronics Corp.
Inventor: Chung-Hao Chen , Chi-Hsiu Hsu , Chi-Fa Lien , Ying-Ting Lin , Cheng-Hsiao Lai , Ya-Nan Mou
Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
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公开(公告)号:US20190043587A1
公开(公告)日:2019-02-07
申请号:US15710851
申请日:2017-09-21
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hsin-Pang Lu , Chi-Hsiu Hsu , Chung-Hao Chen , Ya-Nan Mou , Chung-Cheng Tsai
Abstract: A read only memory (ROM) is provided in the present invention, which includes a plurality of bit lines extending in a first direction, a plurality of source lines extending in parallel to the plurality of bit lines, and a plurality of word lines extending in a second direction perpendicular to the first direction. Each two ROM cells share an active area and are electrically coupled to one of the plurality of source lines by a common source line contact.
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