Abstract:
A phase-locked loop (PLL) and a method for controlling the PLL are provided. The PLL includes a phase detector, a charge pump, a voltage-controlled oscillator (VCO), a feedback frequency divider, and a detector circuit. The phase detector generates a direction signal according to a comparison between phases of a first clock signal and a second clock signal. The charge pump converts the direction signal into a control voltage. The VCO generates a third clock signal. The control voltage controls a frequency of the third clock signal. The feedback frequency divider divides the frequency of the third clock signal to generate the second clock signal. The detector circuit sends a pulse signal to restart the VCO when the control voltage conforms to a preset condition.
Abstract:
An SRAM cell includes two inverters and three transistors. The first inverter includes a first end coupled to a first storage node and a second end coupled to a second storage node. The second inverter includes a first end coupled to the second storage node and a second end coupled to the first storage node. The first transistor includes a first end coupled to the first storage node, a second end and a control end. The second transistor includes a first end coupled to the second end of the first transistor, a second end coupled to a first bit line, and a control end. The third transistor includes a first end coupled between the second end of the first transistor and the first end of the second transistor, a second end, and a control end coupled to the first storage node.
Abstract:
A read only memory (ROM) is provided in the present invention, which includes a plurality of bit lines extending in a first direction, a plurality of source lines extending in parallel to the plurality of bit lines, and a plurality of word lines extending in a second direction perpendicular to the first direction. Each two ROM cells share an active area and are electrically coupled to one of the plurality of source lines by a common source line contact.
Abstract:
A testing method for non-volatile memory includes writing a first set of data to a set of addresses in a non-volatile memory, reading a second set of data from the set of addresses, and writing the first set of data to the set of addresses again if the first set of data and the second set of data are not identical and number of times for writing the first set of data to the set of addresses is smaller than a predetermined number.
Abstract:
A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. The comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein the output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and the comparison result indicates the number of different bits existing between the output data and the input data. The voltage level control unit is configured to generate a control signal according to the comparison result. The voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust the value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.
Abstract:
Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
Abstract:
A voltage regulating circuit provides a feedback voltage and an output voltage based on a power voltage. The voltage regulating circuit includes a reference voltage generator and a compensating circuit. The reference voltage generator receives the power voltage, produces the feedback voltage, and includes an impedance having first and second terminals. The second terminal is coupled to a ground voltage and a first current flows through the impedance at the first terminal to produce the feedback voltage. The compensating circuit includes a negative threshold voltage (NVT) transistor having a source terminal, a drain terminal and a gate terminal. The source terminal receives a power voltage, the drain terminal is connected to the gate terminal and coupled to the first terminal of the impedance through a path to add a second current to the first current when the NVT transistor is turned on under an operational condition at the FF corner.
Abstract:
A voltage regulating circuit provides a feedback voltage and an output voltage based on a power voltage. The voltage regulating circuit includes a reference voltage generator and a compensating circuit. The reference voltage generator receives the power voltage, produces the feedback voltage, and includes an impedance having first and second terminals. The second terminal is coupled to a ground voltage and a first current flows through the impedance at the first terminal to produce the feedback voltage. The compensating circuit includes a negative threshold voltage (NVT) transistor having a source terminal, a drain terminal and a gate terminal. The source terminal receives a power voltage, the drain terminal is connected to the gate terminal and coupled to the first terminal of the impedance through a path to add a second current to the first current when the NVT transistor is turned on under an operational condition at the FF corner.
Abstract:
Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
Abstract:
A read only memory (ROM) is provided in the present invention, which includes a plurality of bit lines extending in a first direction, a plurality of source lines extending in parallel to the plurality of bit lines, and a plurality of word lines extending in a second direction perpendicular to the first direction. Each two ROM cells share an active area and are electrically coupled to one of the plurality of source lines by a common source line contact.