公开(公告)号：US10274942B2

公开(公告)日：2019-04-30

申请号：US15476762

申请日：2017-03-31

Applicant: United Microelectronics Corp.

Inventor： Liu-Lian Chen ,  Xian-Feng Du ,  Guo-Hai Zhang

IPC: G05B19/418 ,  G07C3/14

Abstract: A method for determining abnormal equipment in semiconductor manufacturing system includes processing wafers. A measurement data relating to wafers at respective processing steps and at each tool stack run count for respective tools is provided. The method also includes performing statistical and correlation analysis on the production history data and the measurement data to determine multiple parameters including bad ratio (Rb) and good ratio (Rg) for each tool. A first bad-to-good probability ratio (R1) for each tool is obtained by dividing Rb by Rg at the tool stack run count. A second bad-to-good probability ratio (R2) of each tool is an overall probability ratio of Rb to Rg of each tool. A first correlation coefficient (C1) is provided for the measurement data corresponding to the tool stack run count. A second correlation coefficient (C2) is provided for the first bad-to-good probability ratio (R1) corresponding to the tool stack run count.

公开(公告)号：US20180239340A1

公开(公告)日：2018-08-23

申请号：US15476762

申请日：2017-03-31

Applicant: United Microelectronics Corp.

Inventor： Liu-Lian Chen ,  Xian-Feng Du ,  Guo-Hai Zhang

IPC: G05B19/418 ,  G06F17/18

CPC classification number: G05B19/4184 ,  G05B2219/32191 ,  G05B2219/45032 ,  G07C3/14 ,  Y02P90/02 ,  Y02P90/14

Abstract: A method for determining abnormal equipment in semiconductor manufacturing system includes processing wafers. A measurement data relating to wafers at respective processing steps and at each tool stack run count for respective tools is provided. The method also includes performing statistical and correlation analysis on the production history data and the measurement data to determine multiple parameters including bad ratio (Rb) and good ratio (Rg) for each tool. A first bad-to-good probability ratio (R1) for each tool is obtained by dividing Rb by Rg at the tool stack run count. A second bad-to-good probability ratio (R2) of each tool is an overall probability ratio of Rb to Rg of each tool. A first correlation coefficient (C1) is provided for the measurement data corresponding to the tool stack run count. A second correlation coefficient (C2) is provided for the first bad-to-good probability ratio (R1) corresponding to the tool stack run count.