-
公开(公告)号:US10823465B2
公开(公告)日:2020-11-03
申请号:US15996450
申请日:2018-06-02
发明人: K. Reinhard Radermacher , Ichiro Takeuchi , Yunho Hwang , Yiming Wu , Suxin Qian , Jiazhen Ling
摘要: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
-
公开(公告)号:US10018385B2
公开(公告)日:2018-07-10
申请号:US14860338
申请日:2015-09-21
发明人: Reinhard K. Radermacher , Ichiro Takeuchi , Yunho Hwang , Yiming Wu , Suxin Qian , Jiazhen Ling
CPC分类号: F25B23/00 , C09K5/10 , C09K5/14 , Y02P20/124
摘要: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
-
公开(公告)号:US10801750B2
公开(公告)日:2020-10-13
申请号:US15735538
申请日:2016-06-11
发明人: K. Reinhard Radermacher , Vikrant C. Aute , Yunho Hwang , Jiazhen Ling , Jelena Srebric , Jan Muehlbauer , Rohit Dhumane , Yilin Du , Daniel Alejandro Dalgo Reyes , Nicholas W. Mattise
IPC分类号: F24H9/18 , F24F5/00 , F24H7/04 , F24H7/06 , F24H9/20 , G05D22/02 , G05D23/19 , A61B5/01 , A61B5/024 , A61B5/053
摘要: Despite otherwise uncomfortable conditions in a surrounding environment, a customizable microenvironment can be created around a user to maintain a comfortable temperature and/or humidity level using a comfort unit. For example, the environment may be an office building where conditions are out of the comfortable range to save on energy or for other reasons, a factory/shop environment that is poorly conditioned, or an outdoor location with little to no conditioning. A sensing unit can monitor biometric and environmental data and can determine a comfort level of the user. The comfort unit can then dynamically respond to the determined comfort level and adjust the microenvironment to improve the user's comfort level. The comfort unit can follow the user as the user moves within the macro-environment, or can otherwise move within the macro-environment to achieve certain functions, such as recharging or spatial shifting of thermal load within the overall macro-environment.
-
-