Solid-state heating or cooling systems, devices, and methods

    公开(公告)号:US10823465B2

    公开(公告)日:2020-11-03

    申请号:US15996450

    申请日:2018-06-02

    摘要: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.