公开(公告)号：US07282930B2

公开(公告)日：2007-10-16

申请号：US11314624

申请日：2005-12-21

申请人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

发明人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

IPC分类号： G01R31/302

CPC分类号： G01R31/2831

摘要： A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

摘要翻译： 提供了用于测试诸如晶片或单独基板的薄元件的装置，同时提供用于检查薄元件的反面的设备，其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片，也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板，可在x / y方向上移动和/或转动板的框架，并且如果需要，在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板，其中通过真空使用机械元件（夹紧环，夹紧箔或其它合适的夹紧元件），凝胶封装垫或 粘合剂等

公开(公告)号：US20070139067A1

公开(公告)日：2007-06-21

申请号：US11314624

申请日：2005-12-21

申请人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

发明人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

IPC分类号： G01R31/26

CPC分类号： G01R31/2831

摘要： A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.)

摘要翻译： 提供了用于测试诸如晶片或单独基板的薄元件的装置，同时提供用于检查薄元件的反面的设备，其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片，也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板，可在x / y方向上移动和/或转动板的框架，并且如果需要，在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板，其中通过真空使用机械元件（夹紧环，夹紧箔或其它合适的夹紧元件），凝胶封装垫或 粘合剂等）