公开(公告)号：US09706665B2

公开(公告)日：2017-07-11

申请号：US14314551

申请日：2014-06-25

Applicant: VALEO ETUDES ELECTRONIQUES

Inventor： Laurent Vivet ,  Jean-Michel Morelle ,  Sandra Dimelli ,  Laurent Deneu-Fontaine ,  Romaric Lenoir

IPC: B23P19/00 ,  H05K3/34 ,  B23K1/005 ,  H01L23/00 ,  B23K3/06 ,  B23K101/36

CPC classification number: H05K3/34 ,  B23K1/0056 ,  B23K3/0607 ,  B23K2101/36 ,  H01L24/75 ,  H01L2924/12042 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/10969 ,  H05K2203/0195 ,  H05K2203/0415 ,  H05K2203/107 ,  H05K2203/163 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.