公开(公告)号：US20240081032A1

公开(公告)日：2024-03-07

申请号：US18241689

申请日：2023-09-01

Applicant: VORBECK MATERIALS CORP.

Inventor： DAN SCHEFFER ,  KATE REDMOND ,  TRENTICE BOLAR

IPC: H05K9/00

CPC classification number: H05K9/0007 ,  H05K9/0081

Abstract: The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.

公开(公告)号：US20230180446A1

公开(公告)日：2023-06-08

申请号：US17986529

申请日：2022-11-14

Applicant: Vorbeck Materials Corp.

Inventor： DAN SCHEFFER ,  KATE REDMOND ,  TRENTICE BOLAR

IPC: H05K9/00

CPC classification number: H05K9/0007 ,  H05K9/0081

Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.

公开(公告)号：US20230280440A1

公开(公告)日：2023-09-07

申请号：US17894991

申请日：2022-08-24

Applicant: Vorbeck Materials Corp.

Inventor： JOHN LETTOW ,  SRIRAM MANIVANNAN ,  Dan Scheffer ,  James Allen Turney ,  Christie Burrow ,  Samarpita Chowdhury ,  Victor Contreras ,  TRENTICE BOLAR

IPC: G01S5/06 ,  H01Q1/52 ,  H01Q1/02 ,  H01Q1/27

CPC classification number: G01S5/06 ,  H01Q1/526 ,  H01Q1/02 ,  H01Q1/273

Abstract: Embodiments relate to a communications node that includes an interfacing plate assembly; an antenna assembly; a board mounting assembly; a housing; and an enclosure. The housing includes the antenna assembly and the board mounting assembly. The enclosure is a rigid, open ended, sleeve structure that selectively receives the housing and thereby encloses the antenna assembly and the board mounting assembly therein. An interfacing plate assembly is positioned at a second end. The interfacing plate includes an input device coupled to the control circuit that receives user operational input. The antenna assembly includes an antenna frame that includes the antenna elements and orients the antenna elements in each nodal cardinal direction. The board mounting assembly includes the communication device and the control circuit that are positioned proximate to a plate. The plate is coupled to the first end opposite the interfacing plate and thermally coupled to the control circuit.