公开(公告)号：US6144553A

公开(公告)日：2000-11-07

申请号：US150279

申请日：1998-09-09

申请人： Vince P. Hileman ,  Gary A. Harpell

发明人： Vince P. Hileman ,  Gary A. Harpell

IPC分类号： G11B33/14 ,  H05K7/20

CPC分类号： G11B33/1413

摘要： A refrigeration system for a disk drive storage is provided. The refrigeration system employs pairs of thin conducting plates, each pair of which is placed so as to sandwich a disk drive. The refrigeration system conducts heat generated from the disk drives via the thin conducting plates, heat pipes coupled to the thin conducting plates, a back plate and a chilled manifold. The heat is further removed as a refrigerant travels through to a compressor and then to a condenser, both of which are connected to the chilled manifold. In this way, the disk drive storage is able to increase its capacity from a bank of twelve disk drives to fourteen disk drives for a 1 inch disk drive storage and from eight disk drives to nine disk drives for a 1.6 inch disk drive storage system, thereby realizing an increased density system without sacrificing a low operating temperature.

摘要翻译： 提供了一种用于磁盘驱动器存储器的制冷系统。 制冷系统采用成对的薄导电板，每对薄导电板被放置以夹住磁盘驱动器。 制冷系统通过薄导电板，耦合到薄导电板，背板和冷却歧管的热管来传导从盘驱动器产生的热量。 当制冷剂传递到压缩机然后再到冷凝器时，热量被进一步去除，冷凝器都连接到冷冻歧管。 以这种方式，磁盘驱动器存储器能够将其容量从十二个磁盘驱动器增加到十四个用于1英寸磁盘驱动器存储的磁盘驱动器，从八个磁盘驱动器增加到九个用于1.6英寸磁盘驱动器存储系统的磁盘驱动器， 从而实现增加的密度系统而不牺牲低的工作温度。

公开(公告)号：US06783325B1

公开(公告)日：2004-08-31

申请号：US10109761

申请日：2002-03-29

申请人： Vince P. Hileman ,  Robert J. Lajara ,  Thomas E. Stewart

发明人： Vince P. Hileman ,  Robert J. Lajara ,  Thomas E. Stewart

IPC分类号： F04D2952

CPC分类号： F04D29/601

摘要： The disclosed system is directed towards a tray bracket. The tray bracket comprises a tray bracket inlet, the tray bracket inlet has tray bracket inlet coupling elements. A tray bracket outlet is coupled to the tray bracket inlet and the tray bracket outlet has a body. The tray bracket includes a plurality of tray bracket outlet passages contiguous with the body. The plurality of tray bracket outlet passages are aligned with fan passages of at least one fan unit. The tray bracket outlet passages and the fan passages provide low impedance to air flow and low noise. The tray bracket includes attaching mechanisms contiguous with the body. The attaching mechanisms are manually demountably coupled to the tray bracket inlet coupling elements.

摘要翻译： 所公开的系统指向托架支架。 托盘支架包括托盘支架入口，托盘支架入口具有托盘支架入口耦合元件。 托盘支架出口连接到托盘支架入口，托盘托架出口具有主体。 托盘支架包括与主体相邻的多个托盘支架出口通道。 多个托盘托架出口通道与至少一个风扇单元的风扇通道对齐。 托架支架出口通道和风扇通道对气流和低噪声提供低阻抗。 托盘支架包括与主体相邻的附接机构。 附接机构可手动拆卸地联接到托盘支架入口联接元件。

公开(公告)号：US5999404A

公开(公告)日：1999-12-07

申请号：US172443

申请日：1998-10-14

申请人： Vince P. Hileman

发明人： Vince P. Hileman

IPC分类号： F25D9/00 ,  F25D7/00 ,  H01L23/473 ,  H05K7/20

CPC分类号： H05K7/20345 ,  H01L23/4735 ,  H01L2924/0002

摘要： An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to the modules. The cooling fluid can flow directly onto integrated circuits or integrated circuit packages located within the modules. Each module may have an electrical connector and a fluid connector that allows the sub-module to be plugged into the module, and the module to be plugged into the motherboard and manifold without using any tools or hardware.

摘要翻译： 一种电子系统，其可以包括电子卡子模块，该电子卡子模块电连接到电子卡模块并与电子卡模块流体通信。 电子卡模块可以与母板配合并且耦合到向模块提供冷却流体的冷却系统的歧管。 冷却流体可以直接流到位于模块内的集成电路或集成电路封装。 每个模块可以具有电连接器和允许子模块插入模块的流体连接器，并且模块将被插入到主板和歧管中，而不使用任何工具或硬件。

公开(公告)号：US06215666B1

公开(公告)日：2001-04-10

申请号：US09168702

申请日：1998-10-08

申请人： Vince P. Hileman ,  Cornelius B. O'Sullivan

发明人： Vince P. Hileman ,  Cornelius B. O'Sullivan

IPC分类号： H05K500

CPC分类号： G11B33/124

摘要： A giga-bit interface convertor module bracket assembly having upper and lower ground springs. The upper ground spring has upper wing-shaped springs in the upper part of the front opening of the bracket assembly and a pair of upper spring tabs on the interior of the bracket assembly. The lower ground spring has lower wing-shaped springs in the lower part of the front opening of the bracket assembly and a pair of lower spring tabs on the interior of the bracket assembly. When a giga-bit interface convertor module is inserted in the bracket assembly through the front opening, the upper and lower spring tabs bias against the top and bottom walls of the giga-bit interface convertor module to provide grounding thereto. Additionally, the upper and lower wing-shaped springs contact with a front panel of an enclosure or bracket or an electronic card on which the bracket assembly sits. The lower ground spring is provided with a bottom ground spring to contact the electronic card for grounding.

摘要翻译： 千兆位接口转换器模块支架组件，具有上下接地弹簧。 上部接地弹簧在支架组件的前开口的上部具有上翼形弹簧，在支架组件的内部具有一对上弹簧片。 下接地弹簧在支架组件的前开口的下部具有下翼形弹簧，在支架组件的内部具有一对下弹簧片。 当千兆位接口转换器模块通过前开口插入支架组件时，上下弹簧片偏压千兆位接口转换器模块的顶壁和底壁，以提供接地。 此外，上部和下部翼形弹簧与支架组件所在的外壳或托架或电子卡板的前面板接触。 下接地弹簧设有底部接地弹簧，以接触电子卡以进行接地。

公开(公告)号：US6052285A

公开(公告)日：2000-04-18

申请号：US172555

申请日：1998-10-14

申请人： Vince P. Hileman

发明人： Vince P. Hileman

IPC分类号： H05K7/20

CPC分类号： H05K7/20354

摘要： An electronic assembly that includes a heat pipe that extends from an electronic card. The heat pipe has a condenser end that can be inserted into an elastic thermally conductive port of a manifold. The manifold may be part of a cooling system that removes heat from the condenser end of the heat pipe. The port may include a metal filled elastomeric material. The elastic characteristic of the material may accommodate for tolerances in the system and insure contact between the material and the heat pipe. The metal filler provides a thermal path from the heat pipe to the manifold. The elastic port allows the heat pipe to be coupled to the manifold without any fasteners.

摘要翻译： 一种电子组件，包括从电子卡延伸的热管。 热管具有可以插入歧管的弹性导热端口的冷凝器端。 歧管可以是从热管冷凝器端排出热量的冷却系统的一部分。 端口可以​​包括金属填充的弹性体材料。 材料的弹性特性可适应系统的公差，并确保材料与热管之间的接触。 金属填料提供从热管到歧管的热路径。 弹性端口允许热管在没有任何紧固件的情况下联接到歧管。