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1.发明授权Electronic device enclosures and heatsink structures with thermal management features 有权具有热管理功能的电子设备外壳和散热器结构公开(公告)号：US08760868B2
公开(公告)日：2014-06-24
申请号：US13221796
申请日：2011-08-30
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译： 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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公开(公告)号：US20130050945A1
公开(公告)日：2013-02-28
申请号：US13223030
申请日：2011-08-31
CPC分类号： H05K5/0013 , G06F1/181
摘要： An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.
摘要翻译： 电子设备可以具有其中可以安装诸如集成电路和连接器的电子部件的电子设备外壳结构。 电子设备外壳结构可以包括具有平面上表面构件和四个垂直外壳侧壁结构的上壳体。 上壳体的壳体侧壁结构可以具有形成具有弯曲角的矩形开口的边缘。 下壳体可以具有构造成被容纳在上壳体中的矩形开口内的矩形唇缘的结构。 诸如在上壳体上的向内突出的钩结构和矩形唇缘上的卡扣结构的接合结构可以用于附接上壳体和下壳体。 卡扣结构可以各自具有矩形主开口和横向延伸部分，其沿着唇缘的边缘延伸主开口的宽度。
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3.发明申请ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 有权具有热管理功能的电子器件封装和散热器结构公开(公告)号：US20130050943A1
公开(公告)日：2013-02-28
申请号：US13221796
申请日：2011-08-30
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译： 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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