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1.发明授权Electronic device enclosures and heatsink structures with thermal management features 有权具有热管理功能的电子设备外壳和散热器结构公开(公告)号：US08760868B2
公开(公告)日：2014-06-24
申请号：US13221796
申请日：2011-08-30
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译： 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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公开(公告)号：US20130050945A1
公开(公告)日：2013-02-28
申请号：US13223030
申请日：2011-08-31
CPC分类号： H05K5/0013 , G06F1/181
摘要： An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.
摘要翻译： 电子设备可以具有其中可以安装诸如集成电路和连接器的电子部件的电子设备外壳结构。 电子设备外壳结构可以包括具有平面上表面构件和四个垂直外壳侧壁结构的上壳体。 上壳体的壳体侧壁结构可以具有形成具有弯曲角的矩形开口的边缘。 下壳体可以具有构造成被容纳在上壳体中的矩形开口内的矩形唇缘的结构。 诸如在上壳体上的向内突出的钩结构和矩形唇缘上的卡扣结构的接合结构可以用于附接上壳体和下壳体。 卡扣结构可以各自具有矩形主开口和横向延伸部分，其沿着唇缘的边缘延伸主开口的宽度。
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3.发明申请ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 有权具有热管理功能的电子器件封装和散热器结构公开(公告)号：US20130050943A1
公开(公告)日：2013-02-28
申请号：US13221796
申请日：2011-08-30
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译： 电子设备可以具有其中安装电子部件的壳体。 电子部件可以安装到诸如印刷电路板的基板上。 散热器结构可以散发由电子部件产生的热量。 壳体可以具有通过气隙与散热器结构分离的壳体壁。 外壳壁可以具有整体的支撑结构。 每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。 突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。 每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。
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公开(公告)号：US20130328484A1
公开(公告)日：2013-12-12
申请号：US13492608
申请日：2012-06-08
CPC分类号： H01R13/2421 , H01R13/6205 , H01R13/6666 , H01R13/7175 , H01R31/065 , Y10T29/49222
摘要： Connector adapters that may allow contacts in a connector insert to form electrical connections with contacts in an incompatible connector receptacle. One example may provide a connector adapter for providing a connection between a connector insert and an incompatible connector receptacle. The connector adapter may be a magnetic connector providing a magnetic connector receptacle at a first end to accept a connector insert having an attraction plate. This connector adapter may further provide a connector insert having an attraction plate at a second end to insert into a magnetic connector receptacle on an electrical device.
摘要翻译： 可以允许连接器插入件中的触点与不兼容的连接器插座中的触点形成电连接的连接器适配器。 一个示例可以提供用于在连接器插件和不兼容的连接器插座之间提供连接的连接器适配器。 连接器适配器可以是在第一端处提供磁性连接器插座以接受具有吸引板的连接器插件的磁性连接器。 该连接器适配器还可以提供在第二端具有吸引板的连接器插件，以将其插入到电气设备上的磁性连接器插座中。
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公开(公告)号：US08425286B2
公开(公告)日：2013-04-23
申请号：US11747825
申请日：2007-05-11
申请人： Daniel J. Coster , Daniele De Iuliis , Chiew-Siang Goh , Douglas L. Heirich , Steven Holmes , Jonathan Ive , Sung Kim , Rick Mariano , Thomas J. Misage , Dan Riccio , Tang Yew Tan , Jeremy Yaekel
发明人： Daniel J. Coster , Daniele De Iuliis , Chiew-Siang Goh , Douglas L. Heirich , Steven Holmes , Jonathan Ive , Sung Kim , Rick Mariano , Thomas J. Misage , Dan Riccio , Tang Yew Tan , Jeremy Yaekel
CPC分类号： G06F1/183 , G06F1/181 , H05K5/0221 , Y10T292/0886 , Y10T292/089 , Y10T292/0891 , Y10T292/432
摘要： Quick release couplings for releasably coupling components of a computer to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating the use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.
摘要翻译： 公开了用于将计算机的组件可释放地耦合到计算机的快速释放联接器。 快速释放联接机构通常被配置为允许组件相对于计算机的无需工具的放置。 也就是说，快速释放联接机构被配置为在不使用诸如螺钉，螺栓等的常规紧固件的情况下执行其联接。通过消除紧固件的使用，可以将组件从计算机中插入和移除，而不使用工具（例如，工具 -减）。 此外，快速释放联轴器易于操纵，从而使组件能够快速和直接地组装和拆卸到计算机上（例如，快速释放）。 例如，可以通过简单的推动或拉动运动和/或通过闩锁或手柄的简单轻弹来插入和移除部件。
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公开(公告)号：US08411434B2
公开(公告)日：2013-04-02
申请号：US13339096
申请日：2011-12-28
申请人： Chiew-Siang Goh , Joseph B. Moak , Matthew S. Theobald , Houtan R. Farahani , Ricardo A. Mariano , Eric A. Knopf
发明人： Chiew-Siang Goh , Joseph B. Moak , Matthew S. Theobald , Houtan R. Farahani , Ricardo A. Mariano , Eric A. Knopf
CPC分类号： H05K7/20336 , B23C3/30 , B23C5/08 , B23C2220/36 , B26D3/14 , G06F1/16 , G06F1/181 , G06F1/182 , G06F1/185 , G06F1/187 , G06F1/20 , G06F1/203 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49169 , Y10T29/49826 , Y10T83/04 , Y10T83/869 , Y10T83/9391
摘要： An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.
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公开(公告)号：US20050152106A1
公开(公告)日：2005-07-14
申请号：US10791997
申请日：2004-03-02
申请人： Daniel Coster , Daniele De Iuliis , Chiew-Siang Goh , Douglas Heirich , Steven Holmes , Jonathan Ive , Sung Kim , Rick Mariano , Thomas Misage , Dan Riccio , Tang Tan , Jeremy Yaekel
发明人： Daniel Coster , Daniele De Iuliis , Chiew-Siang Goh , Douglas Heirich , Steven Holmes , Jonathan Ive , Sung Kim , Rick Mariano , Thomas Misage , Dan Riccio , Tang Tan , Jeremy Yaekel
CPC分类号： G06F1/183 , G06F1/181 , H05K5/0221 , Y10T292/0886 , Y10T292/089 , Y10T292/0891 , Y10T292/432
摘要： Quick release couplings for releasably coupling components of a computer to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating the use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.
摘要翻译： 公开了用于将计算机的组件可释放地耦合到计算机的快速释放联接器。 快速释放联接机构通常被配置为允许组件相对于计算机的无需工具的放置。 也就是说，快速释放联接机构被配置为在不使用诸如螺钉，螺栓等的常规紧固件的情况下执行其联接。通过消除紧固件的使用，可以将组件从计算机插入和移除，而不使用工具（例如，工具 -减）。 此外，快速释放联轴器易于操纵，从而使组件能够快速和直接地组装和拆卸到计算机上（例如，快速释放）。 例如，可以通过简单的推动或拉动运动和/或通过闩锁或手柄的简单轻弹来插入和移除部件。
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公开(公告)号：US09048124B2
公开(公告)日：2015-06-02
申请号：US13623436
申请日：2012-09-20
IPC分类号： H05K7/20 , H01L23/10 , H01L23/552 , H01L23/40 , H01L23/473 , H01L23/00 , H01L25/065 , H01L23/373
CPC分类号： H01L23/10 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L23/4006 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1434 , H01L2924/16251 , H01L2924/167 , H01L2924/014 , H01L2924/00
摘要： An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.
摘要翻译： 电子设备可以设置有诸如射频收发机集成电路和对电磁干扰敏感的其他集成电路的电子部件。 金属结构被配置成同时用作电气部件的散热结构和电磁干扰屏蔽。 使用焊料将部件安装到基板上。 金属栅栏结构也焊接到基板上。 每个金属围栏具有覆盖相应的一个部件的开口。 导热弹性体间隙填充垫安装在开口中。 使用围绕间隙填充垫的导电垫片将金属散热结构电气短路到栅栏，使得该结构用作电磁干扰屏蔽。 来自组件的热量穿过间隙填充垫移动到金属散热结构，使得散热结构可以横向扩散并散热。
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公开(公告)号：US20140078677A1
公开(公告)日：2014-03-20
申请号：US13623436
申请日：2012-09-20
CPC分类号： H01L23/10 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L23/4006 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1434 , H01L2924/16251 , H01L2924/167 , H01L2924/014 , H01L2924/00
摘要： An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.
摘要翻译： 电子设备可以设置有诸如射频收发机集成电路和对电磁干扰敏感的其他集成电路的电子部件。 金属结构被配置成同时用作电气部件的散热结构和电磁干扰屏蔽。 使用焊料将部件安装到基板上。 金属栅栏结构也焊接到基板上。 每个金属围栏具有覆盖相应的一个部件的开口。 导热弹性体间隙填充垫安装在开口中。 使用围绕间隙填充垫的导电垫片将金属散热结构电气短路到栅栏，使得该结构用作电磁干扰屏蔽。 来自组件的热量穿过间隙填充垫移动到金属散热结构，使得散热结构可以横向扩散并散热。
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公开(公告)号：US08451598B2
公开(公告)日：2013-05-28
申请号：US12893963
申请日：2010-09-29
申请人： Chiew-Siang Goh , Joseph B. Moak , Matthew S. Theobald , Houtan R. Farahani , Ricardo A. Mariano , Eric A. Knopf
发明人： Chiew-Siang Goh , Joseph B. Moak , Matthew S. Theobald , Houtan R. Farahani , Ricardo A. Mariano , Eric A. Knopf
CPC分类号： H05K7/20336 , B23C3/30 , B23C5/08 , B23C2220/36 , B26D3/14 , G06F1/16 , G06F1/181 , G06F1/182 , G06F1/185 , G06F1/187 , G06F1/20 , G06F1/203 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49169 , Y10T29/49826 , Y10T83/04 , Y10T83/869 , Y10T83/9391
摘要： An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.
摘要翻译： 描述了美观的小型台式计算机。 小型台式计算机可以由单件无缝外壳形成，在所述实施例中，由单个铝合金坯加工。 单件无缝外壳包括美观的脚部支撑件，其具有由RF透明材料形成的至少一部分，其提供用户对所选择的内部部件的访问以及提供电磁（EM）屏蔽。 除了与美学外观相关的设计外，这种简单的设计可以为小型台式电脑带来许多优点。 组装小型台式计算机可能需要更少的组件和更少的时间和精力，并且在单件外壳中不存在接缝可以提供良好的防止内部组件的环境污染以及EM屏蔽的保护。
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