公开(公告)号：US20060221578A1

公开(公告)日：2006-10-05

申请号：US11093445

申请日：2005-03-30

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

摘要翻译： 用于常规存储器模块（例如DIMM）的h9接收器设备，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。

公开(公告)号：US20070211438A1

公开(公告)日：2007-09-13

申请号：US11748020

申请日：2007-05-14

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

公开(公告)号：US20070201212A1

公开(公告)日：2007-08-30

申请号：US11746322

申请日：2007-05-09

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

摘要翻译： 用于常规存储器模块（例如DIMM）的散热装置，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。

公开(公告)号：US20050141194A1

公开(公告)日：2005-06-30

申请号：US10747569

申请日：2003-12-29

申请人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

发明人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

IPC分类号： H01L23/427 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

摘要翻译： 声学和热能管理系统和方法包括微处理器和与微处理器一定距离的热质量传感器，微处理器和热质量以将热能从微处理器转移到热质量的方式热连接到微处理器。 声学和热能管理系统将热量从微处理器传递到热质量，以消除微处理器处的热量，从而限制风扇的运行或操作水平。

公开(公告)号：US20070059176A1

公开(公告)日：2007-03-15

申请号：US11226970

申请日：2005-09-15

申请人： Bret Lehman ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Bret Lehman ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： B64C11/06

CPC分类号： G06F1/20

摘要： A cooling system for cooling a device in a computer system includes a plurality of cooling fans positioned in series. Each cooling fan includes a hub and at least one fan blade connected to the hub. The fan blade rotates relative to the hub about a substantially radially extending axis and between at least a first position and a second position. Drag to a flow of fluid through the cooling system by the fan blade in the second position is less than drag to the flow of fluid through the cooling system by the fan blade in the first position. Upon the hub rotating within the cooling fan, the fan blade is in the first position, and upon the hub stationary within the cooling fan, the fan blade is in the second position. The cooling system also includes a biasing member connected to the fan blade and the hub that biases the fan blade towards the second position.

摘要翻译： 用于冷却计算机系统中的装置的冷却系统包括串联定位的多个冷却风扇。 每个冷却风扇包括轮毂和连接到轮毂的至少一个风扇叶片。 风扇叶片围绕基本上径向延伸的轴线并且在至少第一位置和第二位置之间相对于轮毂旋转。 通过风扇叶片在第二位置的流动通过冷却系统的流动小于通过风扇叶片处于第一位置的通过冷却系统的流体流的阻力。 当轮毂在冷却风扇内旋转时，风扇叶片处于第一位置，并且当毂在冷却风扇内固定时，风扇叶片处于第二位置。 冷却系统还包括连接到风扇叶片和毂的偏置构件，其将风扇叶片朝向第二位置偏置。

公开(公告)号：US20060215366A1

公开(公告)日：2006-09-28

申请号：US11088661

申请日：2005-03-24

申请人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

发明人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.

摘要翻译： 公开了用于从部件去除多余热量的装置，系统和方法。 包括散热器，位于具有过冷却能力的计算机的区域中。 包括热管并且连接到散热器并延伸到位于计算机中的热敏元件。 导热符合垫连接到热敏部件。 导热金属连接器连接到热管和柔性垫。

公开(公告)号：US20060070527A1

公开(公告)日：2006-04-06

申请号：US10959836

申请日：2004-10-06

申请人： Cory Chapman ,  Albert Makley ,  Kenneth Seethaler

发明人： Cory Chapman ,  Albert Makley ,  Kenneth Seethaler

IPC分类号： B01D46/00

CPC分类号： B01D46/0086 ,  B01D46/22 ,  B01D46/46 ,  B01D2273/30 ,  B01D2279/45

摘要： Methods and arrangements for autonomic filter replacement are disclosed. In a digital hardware system, a filter supply mechanism is provided that contains a supply of filter material. A filter collection mechanism is also provided. The supply and collection mechanisms are positioned such that an area of filter is spread across an air intake through which air is drawn by a fan. An electronically controlled drive mechanism is provided to drive the filter collection mechanism in response to a condition indicative of filter use. In response to the condition, a length of unused filter material is drawn from the supply and a corresponding length of used filter material is collected to cause unused filter material to be spread across the air intake.

摘要翻译： 公开了自动过滤器更换的方法和布置。 在数字硬件系统中，提供了包含过滤材料供应的过滤器供应机构。 还提供过滤器收集机构。 供应和收集机构被定位成使得过滤器的区域跨越通过风扇吸入空气的进气口。 提供电控驱动机构以响应于指示过滤器使用的状况来驱动过滤器收集机构。 响应于该条件，从供应源抽出一定长度的未使用的过滤材料，并且收集相应长度的所使用的过滤材料，以使未使用的过滤材料分布在进气口上。

公开(公告)号：US20060039110A1

公开(公告)日：2006-02-23

申请号：US10920575

申请日：2004-08-18

申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F04D19/007 ,  F04D25/0613 ,  F04D25/082 ,  F04D25/166 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure for cooling an electronic component includes a heat sink attached to the component, an inner air duct extending into a central portion of the heat sink, and an outer air duct extending into an outer portion of the heat sink. In inner fan, within the inner air duct, moves air in one direction, while an outer fan, in the outer air duct, moves air in the other direction. The fans may be built as separate rotors, or as separate portions of a single rotor.

摘要翻译： 用于冷却电子部件的结构包括附接到部件的散热器，延伸到散热器的中心部分的内部空气管道和延伸到散热器的外部部分的外部空气管道。 在内部风扇内部，在内部空气管道内沿一个方向移动空气，而外部空气管道中的外部风扇沿另一个方向移动空气。 风扇可以构建为单独的转子，或者作为单个转子的分离部分。

公开(公告)号：US20060002085A1

公开(公告)日：2006-01-05

申请号：US10881358

申请日：2004-06-30

申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink having an air flow director on each of multiple fins attached to a heat sink base. The air flow directors direct most of the air flow from dual push-pull fans towards a midline and a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. The rest of the air flow from the push-pull fans impinges against the air flow directors, providing additional cooling to the fins.

公开(公告)号：US20060002082A1

公开(公告)日：2006-01-05

申请号：US10881339

申请日：2004-06-30

申请人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide a highly efficient system for heat removal from the IC chip. By reducing the size of the lateral fins, additional space is made available for the dual fans. The use of the dual fans allows the fans to run at a lower speed that a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan system if one of the fans should fail.