公开(公告)号：US20020185710A1

公开(公告)日：2002-12-12

申请号：US10157584

申请日：2002-05-28

申请人： Vishay Intertechnology, Inc.

发明人： Felix Zandman ,  Y. Mohammed Kasem ,  Yueh-Se Ho

IPC分类号： H01L021/44 ,  H01L023/544 ,  H01L029/06

CPC分类号： H01L21/76898 ,  H01L23/3107 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate). Since no wire bonds are required, the resulting package is rugged and provides a low-resistance electrical connection between the back and front sides of the dice.

摘要翻译： 在晶片尺寸上制造在骰子的两侧形成触点的半导体封装。 晶片的背面附着在金属板上。 分割骰子的划痕线被锯切以暴露金属板，但切口不延伸通过金属板。 可以包括多个子层的金属层形成在骰子的前侧，金属覆盖金属板的暴露部分并延伸骰子的侧边缘。 金属层的分开的部分也可以覆盖骰子正面上的连接垫。 使用与用于制造第一组锯切的刀片相比较窄的第二组锯切与第一组锯切重合。 结果，金属层保留在连接骰子（通过金属板）的前侧和前侧的骰子的侧边缘上。 由于不需要引线键合，所以产生的封装是坚固的，并且在芯片的背面和前面之间提供低电阻电连接。