摘要:
In a triggering ESD protection structure, the triggering voltage is reduced by introducing one or more corners or spikes into the p-n breakdown junction. This may be done by providing a polygate with a zig-zag pattern to define triangular corners in the drain or anode of the structure.
摘要:
In an ESD protection device making use of a LVTSCR, at least one contacted drain and at least one emitter are formed, and are arranged laterally next to each other to be substantially equidistant from the gate of the LVTSCR, to improve holding voltage and decrease size. The ratio of emitter width to contacted drain width is adjusted to achieve the desired characteristics.
摘要:
In an SCR-based ESD protection clamp, the voltage overshoot during an ESD event is reduced by separately controlling the voltage pulse to the drain and emitter contacts of the SCR. The voltage pulse to the drain is preferably delayed using a delay circuit such as an RC circuit. This allows double conductivity modulation to be achieved with lower voltage overshoot.
摘要:
An apparatus including an electrostatic discharge (ESD) protection structure with a diac in which substancially similar ESD protection is provided for both positive and negative ESD voltages appearing at the circuit electrode sought to be protected.
摘要:
In a stand-alone snapback NMOS ESD protection structure method of manufacturing, the breakdown voltage is reduced and the structure is made more resilient to hot carrier and soft leakage degradation in the gate region by blocking the NLDD and partially blocking the n+ drain region between the gate and drain region.
摘要:
When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the likelihood of punch through occurring between two regions of the rectifier is substantially reduced by forming the collector of the NPN transistor between the emitter and collector of the PNP transistor.
摘要:
In an ESD protection device using a SCR-like structure, a vertical device is provided that is highly robust and easily allows the triggering voltage to be adjusted during manufacture. Furthermore it is implementable in complementary form based on PNP and NPN BJT structures, to provide both positive and negative pulse protection.
摘要:
In a BJT ESD protection structure, the ESD current density is stabilized by partially blocking one or more of the emitter and n+ collector, sinker, and n-buried layer to define a comb-like structure for the partially blocked regions.
摘要:
In an ESD protection device using a LVTSCR-like structure, the holding voltage is increased by placing the p+ emitter outside the drain of the device, thereby retarding the injection of holes from the p+ emitter. The p+ emitter may be implemented in one or more emitter regions formed outside the drain. The drain is split between a n+ drain and a floating n+ region near the gate to avoid excessive avalanche injection and resultant local overheating.
摘要翻译:在使用类似LVTSCR的结构的ESD保护器件中,通过将p +发射极放置在器件的漏极之外,从而延长了p +发射极的空穴注入,从而提高了保持电压。 p +发射极可以在形成在漏极外部的一个或多个发射极区域中实现。 漏极在栅极附近的n +漏极和浮动n +区域之间分开,以避免过度的雪崩注入和局部过热。
摘要:
When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the likelihood of punch through occurring between two regions of the rectifier is substantially reduced by forming the collector of the NPN transistor between the emitter and collector of the PNP transistor.