LVTSCR with compact design
    2.
    发明授权
    LVTSCR with compact design 有权
    LVTSCR设计紧凑

    公开(公告)号:US06911679B1

    公开(公告)日:2005-06-28

    申请号:US10339202

    申请日:2003-01-09

    IPC分类号: H01L27/02 H01L29/417

    CPC分类号: H01L27/0262

    摘要: In an ESD protection device making use of a LVTSCR, at least one contacted drain and at least one emitter are formed, and are arranged laterally next to each other to be substantially equidistant from the gate of the LVTSCR, to improve holding voltage and decrease size. The ratio of emitter width to contacted drain width is adjusted to achieve the desired characteristics.

    摘要翻译: 在使用LVTSCR的ESD保护装置中,形成至少一个接触漏极和至少一个发射极,并且彼此横向地布置成与LVTSCR的栅极基本等距,以提高保持电压并减小尺寸 。 调节发射极宽度与接触漏极宽度的比率以达到所需的特性。

    LVTSCR-like structure with internal emitter injection control
    9.
    发明授权
    LVTSCR-like structure with internal emitter injection control 有权
    具有内部发射体注入控制的LVTSCR样结构

    公开(公告)号:US06720624B1

    公开(公告)日:2004-04-13

    申请号:US10210942

    申请日:2002-08-02

    IPC分类号: H01L2362

    CPC分类号: H01L27/0262 H01L29/87

    摘要: In an ESD protection device using a LVTSCR-like structure, the holding voltage is increased by placing the p+ emitter outside the drain of the device, thereby retarding the injection of holes from the p+ emitter. The p+ emitter may be implemented in one or more emitter regions formed outside the drain. The drain is split between a n+ drain and a floating n+ region near the gate to avoid excessive avalanche injection and resultant local overheating.

    摘要翻译: 在使用类似LVTSCR的结构的ESD保护器件中,通过将p +发射极放置在器件的漏极之外,从而延长了p +发射极的空穴注入,从而提高了保持电压。 p +发射极可以在形成在漏极外部的一个或多个发射极区域中实现。 漏极在栅极附近的n +漏极和浮动n +区域之间分开,以避免过度的雪崩注入和局部过热。