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公开(公告)号:US10547098B2
公开(公告)日:2020-01-28
申请号:US15800887
申请日:2017-11-01
Applicant: WITS Co., Ltd.
Inventor: Sang Beom Lee , Hyung Wook Cho , Jun Seung Yi , Yu Jin Lee , Jae Suk Sung , Dae Ki Lim , Seung Hun Ryu , Ki Won Chang , Jae Hyoung Cho , Si Hyung Kim
Abstract: A double loop antenna includes a source loop comprising: a spiral-shaped conductive source coil pattern disposed on a top surface of a board, and a source capacitor pattern comprising symmetrical conductive patterns disposed on the top surface and a bottom surface of the board; and a resonance loop comprising: a spiral-shaped conductive resonance coil pattern disposed on the bottom surface of the board, and a resonance capacitor pattern comprising symmetrical conductive patterns disposed on the top surface and the bottom surface of the board, wherein the source coil pattern and the resonance coil pattern are formed on different surfaces of the board.
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公开(公告)号:US10469133B2
公开(公告)日:2019-11-05
申请号:US15785955
申请日:2017-10-17
Applicant: WITS Co., Ltd.
Inventor: Dae Ung Ahn , Hyung Wook Cho , Jun Seung Yi , Yu Jin Lee , Seung Hun Ryu , Sang Beom Lee , Dae Ki Lim , Jae Hyoung Cho , Si Hyung Kim
Abstract: An antenna device includes a first wiring may include a spiral shape forming an empty region therein, and a second wiring disposed inside or outside of the first wiring. The second wiring is disposed to be spaced apart from the first wiring, and includes a first ring-shaped wiring and a second ring-shaped wiring, which are concentric to each other.
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公开(公告)号:US11228085B2
公开(公告)日:2022-01-18
申请号:US16723094
申请日:2019-12-20
Applicant: WITS Co., Ltd.
Inventor: Sang Beom Lee , Hyung Wook Cho , Jun Seung Yi , Yu Jin Lee , Jae Suk Sung , Dae Ki Lim , Seung Hun Ryu , Ki Won Chang , Jae Hyoung Cho , Si Hyung Kim
IPC: H01Q7/00 , H01Q1/22 , H01P7/00 , H01F38/14 , H04B5/00 , H01Q5/378 , H01F27/40 , H01F27/28 , H01F5/00 , H01Q25/00
Abstract: A double loop antenna includes a source loop comprising: a spiral-shaped conductive source coil pattern disposed on a top surface of a board, and a source capacitor pattern comprising symmetrical conductive patterns disposed on the top surface and a bottom surface of the board; and a resonance loop comprising: a spiral-shaped conductive resonance coil pattern disposed on the bottom surface of the board, and a resonance capacitor pattern comprising symmetrical conductive patterns disposed on the top surface and the bottom surface of the board, wherein the source coil pattern and the resonance coil pattern are formed on different surfaces of the board.
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公开(公告)号:US10673131B2
公开(公告)日:2020-06-02
申请号:US15994021
申请日:2018-05-31
Applicant: WITS Co., Ltd.
Inventor: Dae Ung Ahn , Jae Hyoung Cho , Dae Seong Jeon , Sung Uk Lee , Ki Won Chang
IPC: H01Q1/38 , H01Q7/00 , G06K19/077 , H04B5/00 , G06K19/07 , H01F27/38 , H01Q1/22 , H01F27/00 , H01Q1/40 , H01F27/28 , H01Q21/28 , H01F38/14 , H01F5/00 , H02J7/02 , H02J50/10
Abstract: A coil assembly includes: a substrate; and a coil wiring coupled to the substrate and including a spiral wiring and a lead wiring, wherein the spiral wiring includes a first section forming an outer portion of the spiral wiring and a second section, disposed inside the first section, and having a line width narrower than a line width of the first section.
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公开(公告)号:US10790675B2
公开(公告)日:2020-09-29
申请号:US16011916
申请日:2018-06-19
Applicant: WITS Co., Ltd.
Inventor: Sang Ho Cho , Chang Ik Kim , Seung Won Park , Yong Woon Park , Sang Beom Lee , Eun Young Shin , Jae Suk Sung , Jae Hyoung Cho
Abstract: There are provided an apparatus for transmitting power wirelessly. The apparatus for transmitting power wirelessly may include a boosting unit boosting an input voltage, and an inverter unit inverting the boosted voltage output from the boosting unit to transmit power wirelessly. The inverter unit and the boosting unit are controlled by the same switching element.
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公开(公告)号:US10748048B2
公开(公告)日:2020-08-18
申请号:US15983196
申请日:2018-05-18
Applicant: WITS Co., Ltd.
Inventor: Jae Hyoung Cho
Abstract: A coil module includes a substrate; an upper coil disposed on at least one surface of the substrate in an upper portion of the substrate; a lower coil disposed on at least one surface of the substrate in a lower portion of the substrate; and a lower outer pattern disposed on an outer side of the lower coil in the lower portion of the substrate and connected to either one or both of the upper coil and the lower coil.
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