Ultrasonic method for forming individual pillowed chips of light lock
material
    1.
    发明授权
    Ultrasonic method for forming individual pillowed chips of light lock material 失效
    用于形成光锁材料的单个枕头芯片的超声波方法

    公开(公告)号:US5531847A

    公开(公告)日:1996-07-02

    申请号:US445001

    申请日:1995-05-19

    摘要: An ultrasonic apparatus and method for forming individual pillowed chips of light lock material are provided. An ultrasonic horn and ultrasonic anvil are used to form pillows in a composite web of light lock material. The pillowed web material is then notched and cut to produce individual chips of light lock material. Each individual chip has one pillowed edge and one non-pillowed, notched edge. The pillowing and notching facilitate placement of the individual chips of light lock material into a film cartridge.

    摘要翻译: 提供一种用于形成光锁材料的单个枕芯的超声波装置和方法。 超声波喇叭和超声波砧座用于在光锁复合材料网中形成枕头。 然后将枕头的网状材料切开并切割以产生单个的锁芯材料的芯片。 每个单独的芯片都有一个枕头边缘和一个非枕头的切口边缘。 卷边和切口便于将光锁材料的各个芯片放置到暗盒中。

    Ultrasonic apparatus for forming individual pillowed chips of light lock
material
    4.
    发明授权
    Ultrasonic apparatus for forming individual pillowed chips of light lock material 失效
    用于形成光锁材料的单个枕头芯片的超声波设备

    公开(公告)号:US5433816A

    公开(公告)日:1995-07-18

    申请号:US4819

    申请日:1993-01-15

    摘要: An ultrasonic apparatus and method for forming individual pillowed chips of light lock material are provided. An ultrasonic horn and ultrasonic anvil are used to form pillows in a composite web of light lock material. The pillowed web material is then notched and cut to produce individual chips of light lock material. Each individual chip has one pillowed edge and one non-pillowed, notched edge. The pillowing and notching facilitate placement of the individual chips of light lock material into a film cartridge.

    摘要翻译: 提供一种用于形成光锁材料的单个枕芯的超声波装置和方法。 超声波喇叭和超声波砧座用于在光锁复合材料网中形成枕头。 然后将枕头的网状材料切开并切割以产生单个的锁芯材料的芯片。 每个单独的芯片都有一个枕头边缘和一个非枕头的切口边缘。 卷边和切口便于将光锁材料的各个芯片放置到暗盒中。

    Ultrasonic apparatus for cutting and placing individual chips of light
lock material
    5.
    发明授权
    Ultrasonic apparatus for cutting and placing individual chips of light lock material 失效
    用于切割和放置光锁材料的单个芯片的超声波设备

    公开(公告)号:US5368464A

    公开(公告)日:1994-11-29

    申请号:US999646

    申请日:1992-12-31

    摘要: The present invention relates to a novel method and apparatus for cutting small pieces of fabric by means of an ultrasonic horn and a hollow open centered cutting anvil. The cutting operation includes a pick mechanism incorporating two tapered pins and a stripper pad to maintain the fabric position before, during, and after the cutting operation. The pick head mechanism is designed to insure accuracy in locating these small fabric pieces, referred to as chips, in a subsequent assembly operation performed by the pick head.The assembly operation relates to attachment of small pieces of fabric by means of two miniature ultrasonic horns. The horns are combined with a pick and place mechanism which incorporates two tapered pins and a stripper pad to maintain the fabric position during the manufacturing process. This pick and place head, when attached to a robotic arm, is designed to insure accuracy in locating these small fabric pieces repeatedly in a thermoplastic cartridge.

    摘要翻译: 本发明涉及一种通过超声波喇叭和中空的开放式中心切割砧切割小块织物的新方法和装置。 切割操作包括采用两个锥形销和剥离垫的拾取机构,以在切割操作之前,期间和之后保持织物位置。 拾取头机构被设计成确保在由拾取头执行的后续组装操作中定位这些被称为芯片的这些小织物片的精度。 组装操作涉及通过两个微型超声波喇叭连接小块织物。 喇叭与拾取和放置机构结合,该机构包括两个锥形销和剥离垫,以在制造过程中保持织物位置。 该拾取和放置头,当连接到机器人手臂时,设计用于确保将这些小织物片重新定位在热塑性塑料盒中的准确性。

    Method for cutting and placing individual chips of light lock material
    6.
    发明授权
    Method for cutting and placing individual chips of light lock material 失效
    用于切割和放置光锁材料的各个芯片的方法

    公开(公告)号:US5512132A

    公开(公告)日:1996-04-30

    申请号:US308885

    申请日:1994-09-19

    摘要: The present invention relates to a novel method and apparatus for cutting small pieces of fabric by means of an ultrasonic horn and a hollow open centered cutting anvil. The cutting operation includes a pick mechanism incorporating two tapered pins and a stripper pad to maintain the fabric position before, during, and after the cutting operation. The pick head mechanism is designed to insure accuracy in locating these small fabric pieces, referred to as chips, in a subsequent assembly operation performed by the pick head.The assembly operation relates to attachment of small pieces of fabric by means of two miniature ultrasonic horns. The horns are combined with a pick and place mechanism which incorporates two tapered pins and a stripper pad to maintain the fabric position during the manufacturing process. This pick and place head, when attached to a robotic arm, is designed to insure accuracy in locating these small fabric pieces repeatedly in a thermoplastic cartridge.

    摘要翻译: 本发明涉及一种通过超声波喇叭和中空的开放式中心切割砧切割小块织物的新方法和装置。 切割操作包括采用两个锥形销和剥离垫的拾取机构,以在切割操作之前,期间和之后保持织物位置。 拾取头机构被设计成确保在由拾取头执行的后续组装操作中定位这些被称为芯片的这些小织物片的精度。 组装操作涉及通过两个微型超声波喇叭连接小块织物。 喇叭与拾取和放置机构结合,该机构包括两个锥形销和剥离垫,以在制造过程中保持织物位置。 该拾取和放置头,当连接到机器人手臂时,设计用于确保将这些小织物片重新定位在热塑性塑料盒中的准确性。