COLUMN MANAGER WITH A MULTI-ZONE THERMAL SYSTEM FOR USE IN LIQUID CHROMATOGRAPHY
    1.
    发明申请
    COLUMN MANAGER WITH A MULTI-ZONE THERMAL SYSTEM FOR USE IN LIQUID CHROMATOGRAPHY 审中-公开
    具有用于液相色谱的多区域热系统的管理员

    公开(公告)号:US20170074838A1

    公开(公告)日:2017-03-16

    申请号:US15360558

    申请日:2016-11-23

    Abstract: A thermal system for use in a column manager of a liquid chromatography system comprises a plurality of spatially separated individually controlled thermoelectric chips. A column module houses a plurality of thermally conductive troughs. Each trough resides in a separate thermal zone to be thermally conditioned individually by one of the individually controlled thermoelectric chips. Each trough is adapted to hold one or more liquid chromatography columns therein. A plurality of spatially separated thermal bridges includes a first thermal bridge thermally coupling one of the thermoelectric chips to a first one of the plurality of troughs and a second thermal bridge of the plurality of thermal bridges thermally coupling another of the thermoelectric chips to a second one of the plurality of troughs.

    Abstract translation: 用于液相色谱系统的柱管理器的热系统包括多个空间分离的独立控制的热电芯片。 列模块容纳多个导热槽。 每个槽位于单独的热区中,由单独控制的热电芯片之一分别进行热调节。 每个槽适于在其中容纳一个或多个液相色谱柱。 多个空间分离的热桥包括将热电芯片中的一个热耦合到多个槽中的第一个槽的第一热桥和多个热桥中的另一个热桥将热耦合到第二热桥的第二热桥 的多个槽。

    Column manager with a multi-zone thermal system for use in liquid chromatography

    公开(公告)号:US10345277B2

    公开(公告)日:2019-07-09

    申请号:US15360558

    申请日:2016-11-23

    Abstract: A thermal system for use in a column manager of a liquid chromatography system comprises a plurality of spatially separated individually controlled thermoelectric chips. A column module houses a plurality of thermally conductive troughs. Each trough resides in a separate thermal zone to be thermally conditioned individually by one of the individually controlled thermoelectric chips. Each trough is adapted to hold one or more liquid chromatography columns therein. A plurality of spatially separated thermal bridges includes a first thermal bridge thermally coupling one of the thermoelectric chips to a first one of the plurality of troughs and a second thermal bridge of the plurality of thermal bridges thermally coupling another of the thermoelectric chips to a second one of the plurality of troughs.

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