Chip on lead frame for small package speed sensor
    1.
    发明授权
    Chip on lead frame for small package speed sensor 有权
    芯片在引线框架上用于小型封装速度传感器

    公开(公告)号:US07378721B2

    公开(公告)日:2008-05-27

    申请号:US11295371

    申请日:2005-12-05

    IPC分类号: H01L23/495 G01P3/42

    摘要: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

    摘要翻译: 传感器封装装置包括支撑一个或多个电气部件的引线框架基板,其连接到并位于引线框架基板上。 还提供了多个引线键合,其将电气部件电连接到引线框架基板,其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件,从而提供传感器 包括引线框架基板,电气部件和引线接合的封装装置,同时不需要印刷电路板(PCB)或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件(例如,磁阻部件)或感测芯片。

    Magnet orientation and calibration for small package turbocharger speed sensor
    2.
    发明授权
    Magnet orientation and calibration for small package turbocharger speed sensor 有权
    小型涡轮增压器速度传感器的磁铁取向和校准

    公开(公告)号:US07269992B2

    公开(公告)日:2007-09-18

    申请号:US11155203

    申请日:2005-06-15

    IPC分类号: G01P21/02

    摘要: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

    摘要翻译: 一种用于定向和校准用于速度传感器的磁体的方法和系统。 可以将磁体映射到其两个或更多个平面,以便相对于保持在速度传感器壳体内的一个或多个磁阻元件精确地定位磁体。 然后可以响应于磁体的映射来识别磁体相对于磁阻元件和传感器外壳的光学位置。 此后,可以将磁体接合到速度传感器壳体,以便实现由速度传感器壳体保持的用于速度检测操作的速度传感器。

    Thermoplastic overmolding for small package turbocharger speed sensor
    3.
    发明授权
    Thermoplastic overmolding for small package turbocharger speed sensor 有权
    小包装涡轮增压器速度传感器的热塑性包覆成型

    公开(公告)号:US07375406B2

    公开(公告)日:2008-05-20

    申请号:US11314328

    申请日:2005-12-20

    IPC分类号: H01L29/82 G01V3/00

    摘要: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

    摘要翻译: 传感器封装装置包括支撑一个或多个电气部件的引线框架基板,其连接到并位于引线框架基板上。 还提供了多个引线键合,其将电气部件电连接到引线框架基板,其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件,从而提供传感器 包括引线框架基板,电气部件和引线接合的封装装置,同时不需要印刷电路板(PCB)或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂和/或焊料以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件(例如,磁阻部件)或感测芯片。

    DIN RAIL MOUNT
    4.
    发明申请
    DIN RAIL MOUNT 有权
    DIN轨道安装

    公开(公告)号:US20080299820A1

    公开(公告)日:2008-12-04

    申请号:US11754770

    申请日:2007-05-29

    IPC分类号: H01R13/60

    CPC分类号: H01R9/2608 H02B1/052

    摘要: A DIN rail mounted device that may be mounted to a DIN rail with minimal components and without requiring the use of tools. In some instances, an electrical device is provided that has one or more integrally formed rigid latches and one or more integrally formed flexible latches. The electrical device may be secured to a DIN rail by first engaging the rigid latches along an upper edge of the DIN rail, and then rotating the device downwards to engage the flexible latches along a lower edge of the DIN rail. The electrical device may be removed by pushing the device upwards, thereby bending the flexible latches downward to a degree where the rigid latches disengage the upper edge of the DIN rail, and then rotating the device forward and down. The flexible latches may be adapted to compress sufficiently to permit this downward travel, and a recess or other opening may be provided behind the flexible latches to allow such movement.

    摘要翻译: DIN导轨安装装置,可以以最少的部件安装到DIN导轨上,无需使用工具。 在一些情况下,提供具有一个或多个一体形成的刚性闩锁和一个或多个一体形成的柔性闩锁的电气装置。 电气设备可以通过首先沿着DIN导轨的上边缘接合刚性闩锁而固定到DIN导轨,然后向下旋转设备以沿着DIN导轨的下边缘接合柔性闩锁。 可以通过向上推动装置来移除电气装置,从而将柔性闩锁向下弯曲到刚性闩锁脱离DIN导轨的上边缘,然后向前和向下旋转装置的程度。 柔性闩锁可以适于足够地压缩以允许这种向下行进,并且可以在柔性闩锁后面设置凹部或其它开口以允许这种移动。

    DIN rail mount
    5.
    发明授权
    DIN rail mount 有权
    DIN导轨安装

    公开(公告)号:US07758368B2

    公开(公告)日:2010-07-20

    申请号:US11754770

    申请日:2007-05-29

    IPC分类号: H01R13/62

    CPC分类号: H01R9/2608 H02B1/052

    摘要: A DIN rail mounted device that may be mounted to a DIN rail with minimal components and without requiring the use of tools. In some instances, an electrical device is provided that has one or more integrally formed rigid latches and one or more integrally formed flexible latches. The electrical device may be secured to a DIN rail by first engaging the rigid latches along an upper edge of the DIN rail, and then rotating the device downwards to engage the flexible latches along a lower edge of the DIN rail. The electrical device may be removed by pushing the device upwards, thereby bending the flexible latches downward to a degree where the rigid latches disengage the upper edge of the DIN rail, and then rotating the device forward and down. The flexible latches may be adapted to compress sufficiently to permit this downward travel, and a recess or other opening may be provided behind the flexible latches to allow such movement.

    摘要翻译: DIN导轨安装装置,可以以最少的部件安装到DIN导轨上,无需使用工具。 在一些情况下,提供具有一个或多个一体形成的刚性闩锁和一个或多个一体形成的柔性闩锁的电气装置。 电气设备可以通过首先沿着DIN导轨的上边缘接合刚性闩锁而固定到DIN导轨,然后向下旋转设备以沿着DIN导轨的下边缘接合柔性闩锁。 可以通过向上推动装置来移除电气装置,从而将柔性闩锁向下弯曲到刚性闩锁脱离DIN导轨的上边缘,然后向前和向下旋转装置的程度。 柔性闩锁可以适于足够地压缩以允许这种向下行进,并且可以在柔性闩锁后面设置凹部或其它开口以允许这种移动。