Chip on lead frame for small package speed sensor
    1.
    发明授权
    Chip on lead frame for small package speed sensor 有权
    芯片在引线框架上用于小型封装速度传感器

    公开(公告)号:US07378721B2

    公开(公告)日:2008-05-27

    申请号:US11295371

    申请日:2005-12-05

    IPC分类号: H01L23/495 G01P3/42

    摘要: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

    摘要翻译: 传感器封装装置包括支撑一个或多个电气部件的引线框架基板,其连接到并位于引线框架基板上。 还提供了多个引线键合,其将电气部件电连接到引线框架基板,其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件,从而提供传感器 包括引线框架基板,电气部件和引线接合的封装装置,同时不需要印刷电路板(PCB)或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件(例如,磁阻部件)或感测芯片。

    Magnet orientation and calibration for small package turbocharger speed sensor
    2.
    发明授权
    Magnet orientation and calibration for small package turbocharger speed sensor 有权
    小型涡轮增压器速度传感器的磁铁取向和校准

    公开(公告)号:US07269992B2

    公开(公告)日:2007-09-18

    申请号:US11155203

    申请日:2005-06-15

    IPC分类号: G01P21/02

    摘要: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

    摘要翻译: 一种用于定向和校准用于速度传感器的磁体的方法和系统。 可以将磁体映射到其两个或更多个平面,以便相对于保持在速度传感器壳体内的一个或多个磁阻元件精确地定位磁体。 然后可以响应于磁体的映射来识别磁体相对于磁阻元件和传感器外壳的光学位置。 此后,可以将磁体接合到速度传感器壳体,以便实现由速度传感器壳体保持的用于速度检测操作的速度传感器。

    Vane actuated magnetic drive mode sensor
    3.
    发明授权
    Vane actuated magnetic drive mode sensor 失效
    叶片驱动磁驱动模式传感器

    公开(公告)号:US07245122B2

    公开(公告)日:2007-07-17

    申请号:US11315924

    申请日:2005-12-21

    IPC分类号: G01B7/14 G01R33/07

    CPC分类号: G01D5/147 F16H59/105

    摘要: A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.

    摘要翻译: 叶片致动驱动模式传感器通常由两个主要部件组成,包括驱动模式传感器阵列和致动器。 传感器阵列可以设置为由多个霍尔效应(HE)传感器,磁体和与传感器相关联的电子装置组成的壳体。 致动器(也称为叶片)可以设置为由诸如黑色金属的磁性材料构成的板,并且可以根据使用者的要求在不同的位置设置有冲孔的孔。 致动器可以连接到用户的驾驶员,并且可以在壳体上和/或内部滑动。

    Humidity sensor, material therefor and method
    4.
    发明授权
    Humidity sensor, material therefor and method 失效
    湿度传感器,材料及方法

    公开(公告)号:US4016308A

    公开(公告)日:1977-04-05

    申请号:US566350

    申请日:1975-04-09

    IPC分类号: G01N27/12 H01C17/065 B05D5/12

    CPC分类号: H01C17/06553 G01N27/121

    摘要: A novel humidity sensor printed and fired on a dielectric substrate comprising an interdigitated pattern of a conductive precious metal with cobalt oxide as the only binder. Sensors according to the invention may be employed as hermeticity detectors in semiconductor packages.

    摘要翻译: 在介电基片上印刷和烧制的新型湿度传感器,其包括导电贵金属的交叉图案,其中氧化钴作为唯一的粘合剂。 根据本发明的传感器可用作半导体封装中的气密性检测器。

    Magnetic sensor with a chip attached to a lead assembly within a cavity
at the sensor's sensing face
    5.
    发明授权
    Magnetic sensor with a chip attached to a lead assembly within a cavity at the sensor's sensing face 失效
    磁传感器,其芯片附接到传感器感测面处的腔内的引线组件

    公开(公告)号:US5912556A

    公开(公告)日:1999-06-15

    申请号:US744592

    申请日:1996-11-06

    CPC分类号: G01D11/245 G01D5/145

    摘要: A geartooth sensor is provided with a carrier shaped to form a cavity in which semiconductor chips can be disposed. The carrier partially encapsulates a permanent magnet and a lead assembly. Unencapsulated portions of the lead assembly are exposed within the cavity to permit semiconductor components to be attached to a portion of the lead assembly. A cover is attached to the carrier to seal the cavity and protect the magnetically sensitive components located therein. The carrier, with its associated lead assembly and permanent magnet, can then be attached to a printed circuit board and a support structure to form a geartooth sensor. A protective enclosure can be disposed over the sensitive components of the geartooth sensor.

    摘要翻译: 齿轮传感器设置有形成为可以设置半导体芯片的空腔的载体。 载体部分地封装永磁体和引线组件。 引线组件的未封装的部分暴露在腔内,以允许半导体部件附接到引线组件的一部分。 盖子附接到载体以密封空腔并保护位于其中的磁敏部件。 载体及其相关的导线组件和永久磁铁可以连接到印刷电路板和支撑结构以形成齿轮传感器。 保护壳可以放置在齿轮传感器的敏感部件上。

    Semiconductor package with integral hermeticity detector
    7.
    发明授权
    Semiconductor package with integral hermeticity detector 失效
    具有集成气密性检测器的半导体封装

    公开(公告)号:US3943557A

    公开(公告)日:1976-03-09

    申请号:US519605

    申请日:1974-10-31

    摘要: The operation of relative humidity sensors made from cobalt oxide on a non-conductive ceramic substrate is improved by heating the sensor for a short period to a high temperature in a reducing atmosphere. This reduces the specific resistance of the device. With a lower resistivity, it is possible to reduce the size of the sensor to the point where it can be included along with a semiconductive device in standard hermetic packages. This makes possible the continuous, one-line monitoring of hermeticity for the life of the circuit without the necessity fo applying a load to the circuit.

    摘要翻译: 在非导电陶瓷基板上由氧化钴制成的相对湿度传感器的操作通过将还原气氛中的传感器短时间加热到高温来改善。 这降低了器件的电阻。 具有较低的电阻率,可以将传感器的尺寸减小到可以与标准密封封装中的半导体器件一起包括的位置。 这使得可以连续,一线地监测电路的使用寿命的气密性,而不需要向电路施加负载。