Method of fabricating grayscale mask using smart cut® wafer bonding process
    1.
    发明授权
    Method of fabricating grayscale mask using smart cut® wafer bonding process 有权
    使用smartcut®晶圆接合工艺制造灰度掩模的方法

    公开(公告)号:US07838174B2

    公开(公告)日:2010-11-23

    申请号:US11657258

    申请日:2007-01-24

    IPC分类号: G03F1/00 G03C5/00

    CPC分类号: G03F1/50 H01L27/14685

    摘要: A method of fabricating a grayscale mask includes preparing a silicon wafer; depositing a layer of Si3N4 directly on the silicon wafer; implanting H+ ions into the silicon wafer to form a defect layer; depositing a first layer of SiOxNy directly on the Si3N4 layer; depositing a layer of SRO directly on the first layer of SiOxNy; patterning and etching the SRO layer to form a microlens array in the SRO layer; depositing a second layer of SiOxNy on the SRO microlens array; CMP to planarize the second layer of SiOxNy; bonding and cleaving the planarized SiOxNyto a quartz plate to form a graymask reticle; etching to remove silicon from the bonded structure; etching to remove SiOxNy and Si3N4 from the bonded structure; and cleaning and drying the graymask reticle.

    摘要翻译: 制造灰度掩模的方法包括制备硅晶片; 在硅晶片上直接沉积一层Si3N4; 将H +离子注入到硅晶片中以形成缺陷层; 在Si 3 N 4层上直接沉积第一层SiOxNy层; 在第一层SiOxNy上直接沉积一层SRO; 图案化和蚀刻SRO层以在SRO层中形成微透镜阵列; 在SRO微透镜阵列上沉积第二层SiOxNy; CMP平面化第二层SiOxNy; 将平面化的SiO x N y键合并切割成石英板以形成灰色掩模掩模; 蚀刻以从结合结构去除硅; 蚀刻从结合结构去除SiOxNy和Si3N4; 并清理并干燥灰色掩模。

    Method of fabricating grayscale mask using smart cut® wafer bonding process
    2.
    发明申请
    Method of fabricating grayscale mask using smart cut® wafer bonding process 有权
    使用智能切割(R)晶片接合工艺制造灰度掩模的方法

    公开(公告)号:US20080176392A1

    公开(公告)日:2008-07-24

    申请号:US11657258

    申请日:2007-01-24

    IPC分类号: H01L21/44

    CPC分类号: G03F1/50 H01L27/14685

    摘要: A method of fabricating a grayscale mask includes preparing a silicon wafer; depositing a layer of Si3N4 directly on the silicon wafer; implanting H+ ions into the silicon wafer to form a defect layer; depositing a first layer of SiOxNy directly on the Si3N4 layer; depositing a layer of SRO directly on the first layer of SiOxNy; patterning and etching the SRO layer to form a microlens array in the SRO layer; depositing a second layer of SiOxNy on the SRO microlens array; CMP to planarize the second layer of SiOxNy; bonding and cleaving the planarized SiOxNy to a quartz plate to form a graymask reticle; etching to remove silicon from the bonded structure; etching to remove SiOxNy and Si3N4 from the bonded structure; and cleaning and drying the graymask reticle.

    摘要翻译: 制造灰度掩模的方法包括制备硅晶片; 在硅晶片上直接沉积一层Si 3 N 4 N 4; 将H +离子注入到硅晶片中以形成缺陷层; 在Si 3 N 4 N层上直接沉积第一层SiO x N y Y y; 在第一SiO 2层上沉积SRO层; 图案化和蚀刻SRO层以在SRO层中形成微透镜阵列; 在SRO微透镜阵列上沉积第二层SiO x N N y O; CMP以使第二层SiO 2平面化; 将平坦化的SiO x N N y键合并切割成石英板以形成灰色掩模掩模版; 蚀刻以从结合结构去除硅; 蚀刻以从结合的结构去除SiO 2和N 3 N 4和S 3 N 4 N 4; 并清理并干燥灰色掩模。

    Error Diffusion-Derived Sub-Resolutional Grayscale Reticle
    3.
    发明申请
    Error Diffusion-Derived Sub-Resolutional Grayscale Reticle 有权
    误差扩散次级分辨灰度光栅

    公开(公告)号:US20100040959A1

    公开(公告)日:2010-02-18

    申请号:US12247130

    申请日:2008-10-07

    IPC分类号: G03F1/00

    CPC分类号: G03F1/50 G03F7/0005

    摘要: A method is provided for forming an error diffusion-derived sub-resolutional grayscale reticle. The method forms at least one partial-light transmissive layer overlying a transparent substrate. At least one unit cell in formed in the transmissive layer. The unit cell is formed by selecting the number of reduced-transmission pixels in the unit cell, and forming a sub-pattern of reduced-transmission pixels in the unit cell. The unit cell is sub-resolutional at a first wavelength.

    摘要翻译: 提供了一种用于形成误差扩散衍生的子分辨灰度掩模版的方法。 该方法形成了覆盖透明衬底的至少一个部分透光层。 在透射层中形成至少一个单电池。 通过选择单位单元中的缩小透射像素的数量,并且在单位单元中形成减少透射像素的子图案来形成单位单元。 单元在第一波长处是次分辨的。

    Sub-Resolutional Grayscale Reticle
    4.
    发明申请
    Sub-Resolutional Grayscale Reticle 有权
    子分辨灰度光栅

    公开(公告)号:US20100040958A1

    公开(公告)日:2010-02-18

    申请号:US12193568

    申请日:2008-08-18

    IPC分类号: G03F1/00

    CPC分类号: G03F1/50 G03F7/0005

    摘要: A sub-resolutional grayscale reticle and associated fabrication method have been presented. The method provides a transparent substrate, and forms a plurality of coincident partial-light transmissive layers overlying the transparent substrate. A pattern is formed, sub-resolutional at a first wavelength, in at least one of the transmissive layers. If there are n transmissive layers, the reticle transmits at least (n+1) intensities of light. In one aspect, each of the plurality of transmissive layers has the same extinction coefficient and the same thickness. In other aspects, the transmissive layers may have different thickness. Then, even if the extinction coefficients are the same, the attenuation of light through each layer is different. The transmission characteristics of the reticle can be further varied if the transmissive layers have different extinction coefficients. Likewise, the transmission characteristics through the sub-resolutional patterns can be varied.

    摘要翻译: 已经提出了一种亚分辨灰度标线和相关的制造方法。 该方法提供透明基板,并且形成覆盖透明基板的多个重合部分透光层。 在至少一个透射层中形成在第一波长处副溶液的图案。 如果存在n个透射层,则光罩传播至少(n + 1)个光强。 在一个方面,多个透射层中的每一个具有相同的消光系数和相同的厚度。 在其它方面,透射层可以具有不同的厚度。 那么即使消光系数相同,每层的光的衰减也是不同的。 如果透射层具有不同的消光系数,则可以进一步改变掩模版的透射特性。 同样,可以改变通过子解决图案的传输特性。

    Method of making a grayscale reticle using step-over lithography for shaping microlenses
    5.
    发明授权
    Method of making a grayscale reticle using step-over lithography for shaping microlenses 失效
    使用逐步光刻制作灰阶标线的方法,用于成型微透镜

    公开(公告)号:US07678512B2

    公开(公告)日:2010-03-16

    申请号:US11657326

    申请日:2007-01-24

    IPC分类号: G03F1/00

    CPC分类号: G03F7/0005 G03F1/50

    摘要: A method of fabricating a grayscale reticle includes preparing a quartz wafer substrate; depositing a layer of SRO on the top surface of the quartz substrate; patterning and etching the SRO to form an initial microlens pattern using step-over lithography; patterning and etching the SRO to form a recessed pattern in the SRO; depositing an opaque film on the SRO; patterning and etching the opaque film; depositing and planarizing a planarizing layer; cutting the quartz wafer into rectangular pieces sized to be smaller than a selected blank reticle; bonding the a piece a to selected reticle blank to form a grayscale reticle; and using the grayscale reticle to form a microlens array on a photoimager.

    摘要翻译: 制造灰度标线的方法包括制备石英晶片衬底; 在石英衬底的顶表面上沉积SRO层; 图案化和蚀刻SRO以使用逐步光刻形成初始微透镜图案; 图案化和蚀刻SRO以在SRO中形成凹陷图案; 在SRO上沉积不透明膜; 图案化和蚀刻不透明膜; 沉积和平坦化平坦化层; 将石英晶片切割成尺寸小于所选空白掩模版的矩形块; 将片a粘合到所选的掩模版坯料上以形成灰度标线; 并使用灰度标线在光学成像仪上形成微透镜阵列。

    Method of fabricating a grayscale mask using a wafer bonding process
    6.
    发明申请
    Method of fabricating a grayscale mask using a wafer bonding process 失效
    使用晶片接合工艺制造灰度掩模的方法

    公开(公告)号:US20080197107A1

    公开(公告)日:2008-08-21

    申请号:US11709008

    申请日:2007-02-20

    IPC分类号: C25F3/00

    CPC分类号: G03F1/68 G03F1/50 G03F1/54

    摘要: A method of fabricating a grayscale mask includes preparing a quartz wafer; depositing a layer of Si3N4 on the quartz wafer; depositing a layer of titanium/TEOS directly on the Si3N4 layer on the backside of the quartz wafer; removing the layer of Si3N4 from the front side of the quartz wafer; depositing a layer of SRO directly on the front side of the quartz wafer; patterning a microlens array on the SRO layer; etching the SRO layer to form a microlens array in the SRO layer; depositing a layer of titanium; patterning and etching the titanium layer; depositing a layer of SiOxNy on the SRO microlens array; CMP to planarize the layer of SiOxNy removing the titanium/TEOS layer from the backside of the quartz wafer; bonding the planarized SiOxNy to a quartz reticle plate; and etching to remove Si3N4 from the bonded structure to form a grayscale mask reticle.

    摘要翻译: 制造灰度掩模的方法包括制备石英晶片; 在石英晶片上沉积一层Si 3 N 4 N 4; 在石英晶片的背面上的Si 3 N 4 N 4层上直接沉积钛/ TEOS层; 从石英晶片的正面去除Si 3 N 4 N 4层; 在石英晶片的正面上直接沉积SRO层; 在SRO层上构图微透镜阵列; 蚀刻SRO层以在SRO层中形成微透镜阵列; 沉积一层钛; 图案化和蚀刻钛层; 在SRO微透镜阵列上沉积一层SiO 2 x N y O; CMP以平坦化从石英晶片的背面去除钛/ TEOS层的SiO 2 x N y层; 将平坦化的SiO x N N y N键合到石英光罩板上; 以及蚀刻以从结合结构去除Si 3 N 4 N 4以形成灰度掩模掩模版。

    Method of making a grayscale reticle using step-over lithography for shaping microlenses
    7.
    发明申请
    Method of making a grayscale reticle using step-over lithography for shaping microlenses 失效
    使用逐步光刻制作灰阶标线的方法,用于成型微透镜

    公开(公告)号:US20080176148A1

    公开(公告)日:2008-07-24

    申请号:US11657326

    申请日:2007-01-24

    IPC分类号: G03F1/00

    CPC分类号: G03F7/0005 G03F1/50

    摘要: A method of fabricating a grayscale reticle includes preparing a quartz wafer substrate; depositing a layer of SRO on the top surface of the quartz substrate; patterning and etching the SRO to form an initial microlens pattern using step-over lithography; patterning and etching the SRO to form a recessed pattern in the SRO; depositing an opaque film on the SRO; patterning and etching the opaque film; depositing and planarizing a planarizing layer; cutting the quartz wafer into rectangular pieces sized to be smaller than a selected blank reticle; bonding the a piece a to selected reticle blank to form a grayscale reticle; and using the grayscale reticle to form a microlens array on a photoimager.

    摘要翻译: 制造灰度标线的方法包括制备石英晶片衬底; 在石英衬底的顶表面上沉积SRO层; 图案化和蚀刻SRO以使用逐步光刻形成初始微透镜图案; 图案化和蚀刻SRO以在SRO中形成凹陷图案; 在SRO上沉积不透明膜; 图案化和蚀刻不透明膜; 沉积和平坦化平坦化层; 将石英晶片切割成尺寸小于所选空白掩模版的矩形块; 将片a粘合到所选的掩模版坯料上以形成灰度标线; 并使用灰度标线在光学成像仪上形成微透镜阵列。

    Semi-transparent film grayscale mask
    8.
    发明授权
    Semi-transparent film grayscale mask 有权
    半透明胶片灰度面膜

    公开(公告)号:US08685596B2

    公开(公告)日:2014-04-01

    申请号:US11950196

    申请日:2007-12-04

    IPC分类号: G03F1/00

    CPC分类号: G03F1/50

    摘要: A grayscale mask made from semi-transparent film layers is provided, along with an associated fabrication method. The method provides a transparent substrate, such as quartz, with a surface. A first layer of a semi-transparent film having a surface with a first surface area, is formed overlying the substrate surface. At least a second layer of the semi-transparent film having a surface with a second surface area greater than the first surface area, is formed overlying the first layer. A first vertical region is formed having a light first attenuation parameter through the combination of substrate, first layer, and second layer. A second vertical region is formed having a light second attenuation parameter through the combination of the first layer and substrate, and a third vertical region is formed having a light third attenuation parameter through the substrate.

    摘要翻译: 提供了由半透明膜层制成的灰度掩模,以及相关的制造方法。 该方法提供具有表面的透明衬底,例如石英。 具有第一表面积的表面的半透明膜的第一层形成在衬底表面上。 至少第二层半透明膜具有第二表面积大于第一表面积的表面,覆盖在第一层上。 通过基板,第一层和第二层的组合形成具有第一衰减参数的第一垂直区域。 通过第一层和衬底的组合形成具有第二衰减参数的第二垂直区域,并且通过衬底形成具有第三衰减参数的第三垂直区域。

    Error diffusion-derived sub-resolutional grayscale reticle
    9.
    发明授权
    Error diffusion-derived sub-resolutional grayscale reticle 有权
    误差扩散衍生的子解析灰度光栅

    公开(公告)号:US07897302B2

    公开(公告)日:2011-03-01

    申请号:US12247130

    申请日:2008-10-07

    IPC分类号: G03F1/00 G06F17/50

    CPC分类号: G03F1/50 G03F7/0005

    摘要: A method is provided for forming an error diffusion-derived sub-resolutional grayscale reticle. The method forms at least one partial-light transmissive layer overlying a transparent substrate. At least one unit cell in formed in the transmissive layer. The unit cell is formed by selecting the number of reduced-transmission pixels in the unit cell, and forming a sub-pattern of reduced-transmission pixels in the unit cell. The unit cell is sub-resolutional at a first wavelength.

    摘要翻译: 提供了一种用于形成误差扩散衍生的子分辨灰度掩模版的方法。 该方法形成了覆盖透明衬底的至少一个部分透光层。 在透射层中形成至少一个单电池。 通过选择单位单元中的缩小透射像素的数量,并且在单位单元中形成减少透射像素的子图案来形成单位单元。 单元在第一波长处是次分辨的。

    Method of fabricating a grayscale mask using a wafer bonding process
    10.
    发明授权
    Method of fabricating a grayscale mask using a wafer bonding process 失效
    使用晶片接合工艺制造灰度掩模的方法

    公开(公告)号:US07682761B2

    公开(公告)日:2010-03-23

    申请号:US11709008

    申请日:2007-02-20

    IPC分类号: G03F1/00

    CPC分类号: G03F1/68 G03F1/50 G03F1/54

    摘要: A method of fabricating a grayscale mask includes preparing a quartz wafer; depositing a layer of Si3N4 on the quartz wafer; depositing a layer of titanium/TEOS directly on the Si3N4 layer on the backside of the quartz wafer; removing the layer of Si3N4 from the front side of the quartz wafer; depositing a layer of SRO directly on the front side of the quartz wafer; patterning a microlens array on the SRO layer; etching the SRO layer to form a microlens array in the SRO layer; depositing a layer of titanium; patterning and etching the titanium layer; depositing a layer of SiOxNy on the SRO microlens array; CMP to planarize the layer of SiOxNy removing the titanium/TEOS layer from the backside of the quartz wafer; bonding the planarized SiOxNy to a quartz reticle plate; and etching to remove Si3N4 from the bonded structure to form a grayscale mask reticle.

    摘要翻译: 制造灰度掩模的方法包括制备石英晶片; 在石英晶片上沉积一层Si3N4; 在石英晶片的背面的Si 3 N 4层上直接沉积钛/ TEOS层; 从石英晶片的前侧去除Si 3 N 4层; 在石英晶片的正面上直接沉积SRO层; 在SRO层上构图微透镜阵列; 蚀刻SRO层以在SRO层中形成微透镜阵列; 沉积一层钛; 图案化和蚀刻钛层; 在SRO微透镜阵列上沉积一层SiOxNy; CMP平面化从石英晶片的背面去除钛/ TEOS层的SiO x N y层; 将平坦化的SiO x N y键合到石英光罩板上; 并蚀刻以从结合结构去除Si 3 N 4,以形成灰度掩模掩模版。