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公开(公告)号:US20120240401A1
公开(公告)日:2012-09-27
申请号:US13436229
申请日:2012-03-30
申请人: Wei-Fang Wu , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
发明人: Wei-Fang Wu , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: B21D53/02
CPC分类号: H01L23/3672 , F28F3/02 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要: A manufacturing method of a heat sink is disclosed. A board having a first width is transported to a machine tool. The board is punched to form multiple sheet bodies. A bent part is formed on a terminal end of each sheet body having a second width. A first combined part protrudes from the bent part. A second combined part is hollowly disposed on the edge of the bent part as an indentation corresponding to the first combined part. The bent part is bent to stand correspondingly to each of the sheet bodies. Each sheet body is cut to form multiple heat dissipation fins. The second width is equal to the first width. When the heat dissipation fins overlap with each other, the first combined part of one heat dissipation fin is connected to the second combined part of another dissipation fin.
摘要翻译: 公开了散热器的制造方法。 具有第一宽度的板被运送到机床。 板被冲压成多个板体。 在具有第二宽度的每个片体的终端上形成弯曲部分。 第一组合部分从弯曲部分突出。 第二组合部分被中空地设置在弯曲部分的边缘上,作为对应于第一组合部分的压痕。 弯曲部分被弯曲成对应于每个片体。 每个片体被切割以形成多个散热片。 第二宽度等于第一宽度。 当散热片彼此重叠时,一个散热片的第一组合部分连接到另一个散热片的第二组合部分。
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公开(公告)号:US20080295995A1
公开(公告)日:2008-12-04
申请号:US12111731
申请日:2008-04-29
申请人: Wei-Fang WU , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
发明人: Wei-Fang WU , Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: F28F7/00
CPC分类号: H01L23/3672 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要: A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed.
摘要翻译: 散热片包括多个散热片。 每个散热片包括片体,至少一个弯曲部分和至少一个第一组合部分。 弯曲部分由片体的终端形成。 第一组合部分沿着与弯曲部分的弯曲方向相反的方向从弯曲部分突出。 还公开了散热器的制造方法。
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公开(公告)号:US07128134B2
公开(公告)日:2006-10-31
申请号:US10981697
申请日:2004-11-05
申请人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: F28D15/04
CPC分类号: H01L23/427 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
摘要翻译: 公开了一种散热模块,以提供良好的散热效率。 第一和第二壳体彼此对应,具有连接到第二壳体的开口的导热结构。 第一和第二壳体和导热结构在其中形成具有多孔结构的封闭结构。
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公开(公告)号:US07007746B2
公开(公告)日:2006-03-07
申请号:US10621452
申请日:2003-07-18
申请人: Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人: Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: F28D15/02
CPC分类号: H01L23/427 , F28D15/043 , H01L2924/0002 , H01L2924/00
摘要: The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.
摘要翻译: 循环冷却装置具有第一室,第二室,第一管和第二管。 在第一室和第二管的内壁上存在多孔结构。 在第二室和多孔结构中存在工作流体。 工作流体在第一室中通过热量蒸发,并且由于压力下降,工作流体的蒸汽通过第一管道移动到第二室。 然后,工作流体的蒸汽冷凝到第二个室中的工作流体。 之后,通过多孔结构将工作流体通过第二管道运送回第一室,从而形成循环冷却装置。
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公开(公告)号:US20050211419A1
公开(公告)日:2005-09-29
申请号:US10981697
申请日:2004-11-05
申请人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: F28D15/00 , F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20
CPC分类号: H01L23/427 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
摘要翻译: 公开了一种散热模块,以提供良好的散热效率。 第一和第二壳体彼此对应,具有连接到第二壳体的开口的导热结构。 第一和第二壳体和导热结构在其中形成具有多孔结构的封闭结构。
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公开(公告)号:US07277285B2
公开(公告)日:2007-10-02
申请号:US11097323
申请日:2005-04-04
申请人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
摘要翻译: 本发明公开了一种散热模块。 散热模块包括两个分开的壳体和多孔结构。 壳体是U形的并且相应地彼此连接以形成密封室。 多孔结构形成在腔室的内表面上。 散热模块还包括连接到密封室的外表面的至少一个导热结构。 导热结构可以是通过焊接,锁定,配合,接合或粘附而连接到室的翅片或导热板。
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公开(公告)号:US20050225943A1
公开(公告)日:2005-10-13
申请号:US11097323
申请日:2005-04-04
申请人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
发明人: Jung-Sung Shih , Wei-Fang Wu , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: H05K7/20 , H01L23/427
CPC分类号: H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
摘要翻译: 本发明公开了一种散热模块。 散热模块包括两个分开的壳体和多孔结构。 壳体是U形的并且相应地彼此连接以形成密封室。 多孔结构形成在腔室的内表面上。 散热模块还包括连接到密封室的外表面的至少一个导热结构。 导热结构可以是通过焊接,锁定,配合,接合或粘附而连接到室的翅片或导热板。
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公开(公告)号:US20090194252A1
公开(公告)日:2009-08-06
申请号:US12241850
申请日:2008-09-30
申请人: Cheng-Chih LEE , Chung-Fa Lee , Yu-Hung Huang , Chin-Ming Chen
发明人: Cheng-Chih LEE , Chung-Fa Lee , Yu-Hung Huang , Chin-Ming Chen
IPC分类号: F28F9/00
CPC分类号: H01L23/427 , F28D15/0233 , F28F3/02 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation module includes a heat sink, a two-phase heat exchange device and a supporting element. The two-phase heat exchange device is located between the supporting element and the heat sink. The supporting element receives the two-phase heat exchange device, and the supporting element has a main body including a bottom part and at least two sidewall parts. An accommodating space is formed by the bottom part and the sidewall parts of the main body of the supporting element to receive the two-phase heat exchange device, and the received two-phase heat exchange device is attached to the bottom part of the main body of the supporting element. The two-phase heat exchange device is located and sandwiched between the supporting element and the heat sink.
摘要翻译: 散热模块包括散热器,两相热交换装置和支撑元件。 两相热交换装置位于支撑元件和散热片之间。 支撑元件接收两相热交换装置,并且支撑元件具有包括底部和至少两个侧壁部分的主体。 容纳空间由支撑元件的主体的底部和侧壁部分形成,以容纳两相热交换装置,接收的两相热交换装置安装在主体的底部 的支撑元件。 两相热交换装置位于支架和散热片之间。
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公开(公告)号:US20080295994A1
公开(公告)日:2008-12-04
申请号:US12068840
申请日:2008-02-12
申请人: Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
发明人: Cheng-Chih Lee , Yu-Hung Huang , Chin-Ming Chen
CPC分类号: H01L23/3672 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要: A heat-dissipating fin assembly including a first fin and a second fin is provided. Each of the first fin and the second fin respectively includes a body, a bending part and a connecting part. The bending part is bent from an end of the body to form a turning portion along a predetermined direction. The connecting part, located near a turning portion of the bending part from the end of the body, extends opposite to the predetermined direction. When the first fin is connected to the second fin, the connecting part of the first fin is connected with the second fin. Also, an assembling method of the heat-dissipating fin assembly is provided.
摘要翻译: 提供了包括第一翅片和第二翅片的散热翅片组件。 第一翅片和第二翅片中的每一个分别包括主体,弯曲部和连接部。 弯曲部分从主体的端部弯曲成沿预定方向形成转动部分。 所述连接部从所述主体的端部靠近所述弯曲部的转动部,与所述规定方向相反地延伸。 当第一鳍片连接到第二鳍片时,第一鳍片的连接部分与第二鳍片连接。 此外,提供了散热片组件的组装方法。
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公开(公告)号:US20090168351A1
公开(公告)日:2009-07-02
申请号:US12102524
申请日:2008-04-14
申请人: Chin-Ming Chen , Yu-Hung Huang , Chih-Hao Hsia , Shu-Hui Chan , Hao-Wen Ko
发明人: Chin-Ming Chen , Yu-Hung Huang , Chih-Hao Hsia , Shu-Hui Chan , Hao-Wen Ko
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , F04D25/0613 , F04D29/601 , H01L23/4006 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要: The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member.
摘要翻译: 本发明提供一种散热模块及其风扇。 散热模块包括散热器和无框风扇。 风扇位于散热器内。 风扇包括马达基座,叶轮,马达和至少一个接合构件。 叶轮和马达设置在马达基座上。 电动机驱动叶轮旋转,并且接合构件从电动机底座径向延伸。 风扇通过接合构件直接组装到散热器。
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