公开(公告)号：USD626521S1

公开(公告)日：2010-11-02

申请号：US29358136

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Cheng-Hsien Kuo ,  Shih-Her Chen

设计人： Wei-Hau Chen ,  Cheng-Hsien Kuo ,  Shih-Her Chen

公开(公告)号：USD626520S1

公开(公告)日：2010-11-02

申请号：US29358129

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Shih-Her Chen ,  Cheng-Hsien Kuo

设计人： Wei-Hau Chen ,  Shih-Her Chen ,  Cheng-Hsien Kuo

公开(公告)号：US08411443B2

公开(公告)日：2013-04-02

申请号：US13011283

申请日：2011-01-21

申请人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

发明人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。

公开(公告)号：USD659110S1

公开(公告)日：2012-05-08

申请号：US29358133

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Cheng-Hsien Kuo

设计人： Wei-Hau Chen ,  Cheng-Hsien Kuo

公开(公告)号：US08531845B2

公开(公告)日：2013-09-10

申请号：US13074107

申请日：2011-03-29

申请人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

发明人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

IPC分类号： H05K5/00

CPC分类号： H05K5/0208

摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。

公开(公告)号：US20120250271A1

公开(公告)日：2012-10-04

申请号：US13074107

申请日：2011-03-29

申请人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

发明人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

IPC分类号： H05K5/02

CPC分类号： H05K5/0208

摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。

公开(公告)号：US20090288804A1

公开(公告)日：2009-11-26

申请号：US12213595

申请日：2008-06-23

申请人： Wei-Hau Chen ,  Steven Yen

发明人： Wei-Hau Chen ,  Steven Yen

IPC分类号： F28F7/00

CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

摘要翻译： 散热器包括第一热分配单元，其包括多个热分配板，在该分配板之间夹有芯片。 基板连接在第一热量分配单元的顶部，第二散热单元固定在基板的顶部。 基板通过两个夹紧构件连接到第一散热单元。 夹持构件各自具有固定到基板的第一部分和可移除地连接到第一部分的第二板。 第二部分连接到第一热分配单元。 第二热分配单元可以是风扇，水冷单元或铝挤压构件。

公开(公告)号：US07471514B2

公开(公告)日：2008-12-30

申请号：US11822046

申请日：2007-07-02

申请人： Wei-Hau Chen

发明人： Wei-Hau Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

公开(公告)号：US07661461B2

公开(公告)日：2010-02-16

申请号：US11819344

申请日：2007-06-27

申请人： Wei-Hau Chen

发明人： Wei-Hau Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/00 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.

摘要翻译： 冷却装置包括连接在CPU上的基座和管单元2，其包括与基座接合的多个吸收管。 多个冷却管连接到吸收管的两端，并以V形向上延伸。 两个冷却单元连接到冷却管，并且每个冷却单元包括翅片和冷却风扇，其产生空气流向散热片并且冷却CPU周围的部件。

公开(公告)号：US20090288803A1

公开(公告)日：2009-11-26

申请号：US12155853

申请日：2008-06-11

申请人： Wei-Hau Chen ,  Steven Yen

发明人： Wei-Hau Chen ,  Steven Yen

IPC分类号： F28F7/00

CPC分类号： H01L23/3677 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

摘要翻译： 散热器包括第一热分配单元，其包括多个热分配板，在该分配板之间夹有芯片。 基板连接在第一热量分配单元的顶部，两个接合部分连接到基板的两端。 第二散热单元固定在基板的顶部上。 两个夹具将基板连接到第一个散热装置。 第二热分配单元可以是风扇，水冷单元或铝挤压构件。