公开(公告)号：US08411443B2

公开(公告)日：2013-04-02

申请号：US13011283

申请日：2011-01-21

申请人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

发明人： Wei-Hau Chen ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。

公开(公告)号：US20120188707A1

公开(公告)日：2012-07-26

申请号：US13011283

申请日：2011-01-21

申请人： Wei-Hau CHEN ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

发明人： Wei-Hau CHEN ,  Tien-Chen Huang ,  Cheng-Hsien Kuo ,  Hsiao-Jung Lin

IPC分类号： G06F1/20

CPC分类号： G06F1/20

摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。

公开(公告)号：USD659110S1

公开(公告)日：2012-05-08

申请号：US29358133

申请日：2010-03-23

申请人： Wei-Hau Chen ,  Cheng-Hsien Kuo

设计人： Wei-Hau Chen ,  Cheng-Hsien Kuo

公开(公告)号：US08531845B2

公开(公告)日：2013-09-10

申请号：US13074107

申请日：2011-03-29

申请人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

发明人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

IPC分类号： H05K5/00

CPC分类号： H05K5/0208

摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。

公开(公告)号：US07205644B2

公开(公告)日：2007-04-17

申请号：US10904975

申请日：2004-12-08

申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

IPC分类号： H01L23/02 ,  H01L23/28

CPC分类号： B82Y10/00 ,  G11C5/02 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。

公开(公告)号：US20080143008A1

公开(公告)日：2008-06-19

申请号：US11562358

申请日：2006-11-21

申请人： CHENG-HSIEN KUO ,  MING-JHY JIANG

发明人： CHENG-HSIEN KUO ,  MING-JHY JIANG

IPC分类号： B29C45/34

CPC分类号： B29C45/34 ,  B29C45/76 ,  B29C45/77 ,  B29C2045/0094 ,  B29L2017/006

摘要： A molding apparatus includes a die set having a chamber, a vacuum pump communicated to the chamber, and a feeding mechanism suited for supplying a molding material to the chamber of the die set with simultaneous extraction of gas out of the chamber by the vacuum pump.

摘要翻译： 成型装置包括具有室的模具组，与室连通的真空泵，以及适于将模塑材料供应到模具室的进料机构，同时通过真空泵将气体提取出室。

公开(公告)号：US20060077749A1

公开(公告)日：2006-04-13

申请号：US10904975

申请日：2004-12-08

申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

IPC分类号： G11C8/02

CPC分类号： B82Y10/00 ,  G11C5/02 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。

公开(公告)号：US20060076662A1

公开(公告)日：2006-04-13

申请号：US10904976

申请日：2004-12-08

申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

IPC分类号： H01L23/02

CPC分类号： H01L23/5388 ,  B82Y10/00 ,  G06K19/07745 ,  G11C5/02 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.

摘要翻译： 提供一种存储卡结构，其包括基板，多个存储芯片，一些模塑料和超薄塑料外壳。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有腔体和围绕腔体的多个内部触点。 外部触点和内部触点彼此电连接。 存储器芯片堆叠在腔内的相同区域中。 此外，存储器芯片电连接到内部触点。 然后，存储芯片和内部触点被封装。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料壳的部分厚度约为0.1〜0.4mm。

公开(公告)号：US20050017392A1

公开(公告)日：2005-01-27

申请号：US10871359

申请日：2004-06-18

申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Chih-Chen Huang

发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Chih-Chen Huang

IPC分类号： B29C45/34 ,  B29C45/77

CPC分类号： B29C45/34 ,  B29C45/76 ,  B29C45/77 ,  B29C2045/0094 ,  B29L2017/006

摘要： A molding apparatus includes a die set having a chamber, a vacuum pump communicated to the chamber, and a feeding mechanism suited for supplying a molding material to the chamber of the die set with simultaneous extraction of gas out of the chamber by the vacuum pump.

摘要翻译： 成型装置包括具有室的模具组，与室连通的真空泵，以及适于将模塑材料供应到模具室的进料机构，同时通过真空泵将气体提取出室。

公开(公告)号：US20120250271A1

公开(公告)日：2012-10-04

申请号：US13074107

申请日：2011-03-29

申请人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

发明人： Wei-Hau Chen ,  Chen-Chia Pai ,  Tien-Chen Huang ,  Cheng-Hsien Kuo

IPC分类号： H05K5/02

CPC分类号： H05K5/0208

摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。