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公开(公告)号：US08531845B2
公开(公告)日：2013-09-10
申请号：US13074107
申请日：2011-03-29
申请人： Wei-Hau Chen , Chen-Chia Pai , Tien-Chen Huang , Cheng-Hsien Kuo
发明人： Wei-Hau Chen , Chen-Chia Pai , Tien-Chen Huang , Cheng-Hsien Kuo
IPC分类号： H05K5/00
CPC分类号： H05K5/0208
摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.
摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。
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公开(公告)号：US20120250271A1
公开(公告)日：2012-10-04
申请号：US13074107
申请日：2011-03-29
申请人： Wei-Hau Chen , Chen-Chia Pai , Tien-Chen Huang , Cheng-Hsien Kuo
发明人： Wei-Hau Chen , Chen-Chia Pai , Tien-Chen Huang , Cheng-Hsien Kuo
IPC分类号： H05K5/02
CPC分类号： H05K5/0208
摘要： A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.
摘要翻译： 用于固态盘的防篡改盒的结构包括上壳体和下壳体。 上壳体具有分别形成在凸缘的两侧上的延伸部分。 延伸部分具有至少一个开口。 下壳体对应于上壳体，并且在其间形成有用于接收固态盘的空间。 下壳体具有形成在与开口对应的凸缘处的钩。 钩和开口互相扣合。 当上下壳体分离时，钩子将被开口中的法兰断开，从而防止用户强力打开机箱进行自我维护或更换内部部件。
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3.发明授权Slidingly-engaged heat-dissipating assembly for memory and memory device having the same 有权具有相同功能的存储器和存储器件的滑动接合散热组件公开(公告)号：US08411443B2
公开(公告)日：2013-04-02
申请号：US13011283
申请日：2011-01-21
申请人： Wei-Hau Chen , Tien-Chen Huang , Cheng-Hsien Kuo , Hsiao-Jung Lin
发明人： Wei-Hau Chen , Tien-Chen Huang , Cheng-Hsien Kuo , Hsiao-Jung Lin
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.
摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。
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4.发明申请SLIDINGLY-ENGAGED HEAT-DISSIPATING ASSEMBLY FOR MEMORY AND MEMORY DEVICE HAVING THE SAME 有权具有相同功能的存储器和存储器件的滑动式散热组件公开(公告)号：US20120188707A1
公开(公告)日：2012-07-26
申请号：US13011283
申请日：2011-01-21
申请人： Wei-Hau CHEN , Tien-Chen Huang , Cheng-Hsien Kuo , Hsiao-Jung Lin
发明人： Wei-Hau CHEN , Tien-Chen Huang , Cheng-Hsien Kuo , Hsiao-Jung Lin
IPC分类号： G06F1/20
CPC分类号： G06F1/20
摘要： A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.
摘要翻译： 散热组件包括粘附到存储器两侧的第一散热体和第二散热体。 第一散热体的底部边缘具有第一支撑件和包括第一止动部分和第一插入部分的第一接合件。 第二散热体的底部边缘具有第二支撑件和包括第二止动部分和第二插入部分的第二接合件。 第二插入部朝向第一插入部延伸。 第一插入部滑动地设置在第二停止部内。 第二插入件滑动地设置在第一停止部分内。 第一止动部与第二止挡部抵接，使第一卡合片和第二卡合片滑动接合。
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公开(公告)号：USD626521S1
公开(公告)日：2010-11-02
申请号：US29358136
申请日：2010-03-23
申请人： Wei-Hau Chen , Cheng-Hsien Kuo , Shih-Her Chen
设计人： Wei-Hau Chen , Cheng-Hsien Kuo , Shih-Her Chen
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公开(公告)号：USD659110S1
公开(公告)日：2012-05-08
申请号：US29358133
申请日：2010-03-23
申请人： Wei-Hau Chen , Cheng-Hsien Kuo
设计人： Wei-Hau Chen , Cheng-Hsien Kuo
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公开(公告)号：USD626520S1
公开(公告)日：2010-11-02
申请号：US29358129
申请日：2010-03-23
申请人： Wei-Hau Chen , Shih-Her Chen , Cheng-Hsien Kuo
设计人： Wei-Hau Chen , Shih-Her Chen , Cheng-Hsien Kuo
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公开(公告)号：US07205644B2
公开(公告)日：2007-04-17
申请号：US10904975
申请日：2004-12-08
CPC分类号： B82Y10/00 , G11C5/02 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.
摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。
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公开(公告)号：US20060071313A1
公开(公告)日：2006-04-06
申请号：US10904974
申请日：2004-12-08
IPC分类号： H01L23/02
CPC分类号： H01L23/5388 , H01L25/0655 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/117 , H05K3/284 , H05K5/0256 , H05K5/064 , H05K2203/1316 , H01L2224/0401
摘要： A memory card. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electively connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electively connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.
摘要翻译： 一张记忆卡 存储卡包括基板，多个电子封装装置，模塑料和塑料成形材料。 衬底具有至少多个外部触点和多个内部触点，并且外部触点选择性地连接到内部触点。 电子封装器件位于衬底上，并且电子封装器件分别选择性地连接到内部触点。 模塑料覆盖电子封装装置和相应的内部触点。 塑料成型材料覆盖模塑料和基材，塑料成型材料暴露外触点。
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公开(公告)号：US20060077749A1
公开(公告)日：2006-04-13
申请号：US10904975
申请日：2004-12-08
IPC分类号： G11C8/02
CPC分类号： B82Y10/00 , G11C5/02 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.
摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。
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