公开(公告)号：US20120318852A1

公开(公告)日：2012-12-20

申请号：US13524245

申请日：2012-06-15

Applicant: Wen-Bing ZHOU ,  Youg-Jun LIAO ,  Qiang WANG ,  Hung-Che CHEN

Inventor： Wen-Bing ZHOU ,  Youg-Jun LIAO ,  Qiang WANG ,  Hung-Che CHEN

IPC: B23K31/02 ,  H05K9/00

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K3/3468 ,  H05K2201/09418 ,  H05K2201/0949 ,  H05K2201/10409 ,  H05K2203/044

Abstract: A method of preventing EMI for a fastening hole in a circuit board includes the steps of providing a circuit board which includes a plurality of fastening holes extending through opposite first and second surfaces thereof and a plurality of solder pads disposed on the second surface, each fastening hole being surrounded by the solder pads; disposing an electronic component on the first surface; positioning the circuit board on a fixture such that the solder pads are not covered by the fixture; and wave soldering the circuit board so that the electronic component is fixed to the circuit board and the solder pads are attached with solder materials.

Abstract translation: 防止EMI对电路板中的紧固孔的方法包括以下步骤：提供电路板，其包括延伸穿过其相对的第一和第二表面的多个紧固孔以及设置在第二表面上的多个焊盘，每个紧固 孔被焊垫包围; 在第一表面上设置电子部件; 将电路板定位在固定装置上，使得焊盘不被夹具覆盖; 并且将电路板波峰焊接，使得电子部件固定到电路板，并且焊盘用焊料材料附着。