公开(公告)号：US09763319B2

公开(公告)日：2017-09-12

申请号：US14706269

申请日：2015-05-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi Inagaki ,  Yasuhiro Takahashi ,  Satoshi Kurokawa

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H01L23/538 ,  H01L25/18 ,  H01L23/498

CPC classification number: H05K1/0243 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0949 ,  H05K2201/09518 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A package substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, an outermost conductor layer including first and second pads to mount electronic components, vias including first and second vias such that the first vias are connecting the first conductor layer and first pads and the second vias are connecting the first conductor layer and second pads, and skip vias penetrating through the outermost and inner interlayers such that the skip vias are connecting the outermost and second conductor layers. Sum of insulation distances (t1, t2) is in range of 40 μm or less to 10 μm or more, where the insulation distance (t1) is insulation distance between the outermost and first conductor layers and the insulation distance (t2) is insulation distance between the first and second conductor layers, and difference between the insulation distances (t1, t2) is less than 5 μm.

公开(公告)号：US20170117670A1

公开(公告)日：2017-04-27

申请号：US15398793

申请日：2017-01-05

Applicant: CommScope, Inc of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R13/6469 ,  H01R24/28 ,  H01R12/53 ,  H01R24/64 ,  H01R13/6466

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

公开(公告)号：US20170040762A1

公开(公告)日：2017-02-09

申请号：US15333228

申请日：2016-10-25

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/64 ,  H01R13/6466 ,  H05K1/11 ,  H01R13/66 ,  H01R24/28 ,  H01R12/53 ,  H01R13/6469

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。

公开(公告)号：US09462679B2

公开(公告)日：2016-10-04

申请号：US14256029

申请日：2014-04-18

Applicant: ADVANCED FLEXBLE CIRCUITS CO., LTD.

Inventor： Ching-Cheng Tien ,  Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/0227 ,  H05K1/0245 ,  H05K3/3421 ,  H05K2201/0949 ,  H05K2201/09727 ,  H05K2201/10189 ,  H05K2201/10689

Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Abstract translation: 用于柔性电路板的连接焊盘的衰减减小接地图形结构包括形成在基板的部件表面上的多个高频连接焊盘和布置在基板上的多个差模信号线，并连接到高频连接焊盘 。 基板具有形成接地层的接地面。 接地层包括形成在对应于过渡区域的位置并且包括中空区域和突出部分的衰减减小接地图案结构。 突出部分在从接地层朝向高频连接焊盘的方向上延伸预定长度，并沿着相邻的高频连接焊盘延伸到达过渡区。 突出部分和高频连接焊盘在过渡区域中形成偏振方向变化的电场。

公开(公告)号：US09313889B2

公开(公告)日：2016-04-12

申请号：US14262658

申请日：2014-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungsuk Yang ,  Jeong-Kyu Ha ,  PaLan Lee ,  Narae Shin ,  Soyoung Lim ,  Jae-Min Jung ,  KyongSoon Cho

IPC: H05B33/00 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。

公开(公告)号：US20150244120A1

公开(公告)日：2015-08-27

申请号：US14708366

申请日：2015-05-11

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/64 ,  H01R13/6463 ,  H01R13/627 ,  H01R13/42

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US09054460B2

公开(公告)日：2015-06-09

申请号：US13762433

申请日：2013-02-08

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott L. Michaelis

IPC: H01R24/00 ,  H01R13/658 ,  H01R43/20 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H01R24/64 ,  H05K1/11 ,  H01R12/53 ,  H01R24/28 ,  H05K1/02

CPC classification number: H01R13/658 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R43/205 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US20150111432A1

公开(公告)日：2015-04-23

申请号：US14547165

申请日：2014-11-19

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R13/6469 ,  H01R13/6466 ,  H01R24/64

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

Abstract translation: 提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。 插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。 第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。 第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分 的各自的第一部分。

公开(公告)号：US08705238B2

公开(公告)日：2014-04-22

申请号：US12926710

申请日：2010-12-06

Applicant: Yasutaka Nakashiba ,  Kenta Ogawa

Inventor： Yasutaka Nakashiba ,  Kenta Ogawa

IPC: H05K7/20 ,  H01L23/48 ,  H01F7/06

CPC classification number: H01L28/10 ,  G11C5/005 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/49855 ,  H01L23/5227 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L27/0688 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15183 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/1316 ,  H05K2203/1572 ,  Y10T29/4902 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.

Abstract translation: 存储元件设置在半导体芯片中，并且电感器和驱动电路设置在另一半导体芯片中。 外部端子是接触型端子，至少一些外部端子是电源端子和接地端子。 在互连基板的第一表面上形成密封树脂层，并密封半导体芯片，但不覆盖外部端子。 电感器形成在不面向互连基板的半导体芯片的表面。