专利检索 ap:("Weng Khoon Mong" OR "Yew Wee Cheong" OR "Eng Chiang Gan" OR "Mun Leong Loke") AND inv:"Eng Chiang Gan" 第 1 页

1.

发明授权
Method of thinning a wafer utilizing a laminated reinforcing layer over the device side 有权
标题翻译：使用层叠增强层在装置侧进行薄片化的方法

公开(公告)号：US06713366B2

公开(公告)日：2004-03-30

申请号：US10170926

申请日：2002-06-12

申请人： Weng Khoon Mong , Yew Wee Cheong , Eng Chiang Gan , Mun Leong Loke

发明人： Weng Khoon Mong , Yew Wee Cheong , Eng Chiang Gan , Mun Leong Loke

IPC分类号： H01L21302

CPC分类号： H01L21/6835 , H01L21/304 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386 , Y10S438/977

摘要： A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.

摘要翻译： 一种方法，包括：获得衬底，将增强层放置在所述衬底的第一侧上; 以及通过从衬底的相对侧去除材料来使衬底变薄。