-
公开(公告)号：US6040204A
公开(公告)日：2000-03-21
申请号：US143309
申请日：1998-08-28
申请人： Werner Herden , Johann Konrad , Hans-Peter Jahn , Martin Knapp , Hans-Peter Fuessl , Ning Qu
发明人： Werner Herden , Johann Konrad , Hans-Peter Jahn , Martin Knapp , Hans-Peter Fuessl , Ning Qu
IPC分类号： H01L25/07 , H01L21/98 , H01L27/00 , H01L29/866 , H01L23/10
CPC分类号： H01L25/50 , H01L2924/0002
摘要： A method for manufacturing chip stacks in which wafers are stacked one on top of the other. The wafer is provided with an adhesive foil on its bottom, and is subsequently cut into chips so that the adhesive foil remains intact and the chips adhering to the adhesive foil are stacked one on top of the other. A first layer of chips is reversibly attached to a baseplate, the adhesive foil is removed, the next layer of chips is attached to the bottom side of the chips already fastened to the baseplate, the adhesive foil is removed, and the last two steps are repeated until the desired number of chips is stacked one on top of the other.
摘要翻译： 一种制造芯片堆叠的方法，其中晶片彼此层叠。 晶片在其底部设置有粘合剂箔，随后被切割成芯片，使得粘合箔保持完整，并且粘附到粘合剂箔的芯片一个堆叠在另一个之上。 第一层芯片可逆地连接到基板上，去除粘合箔，下一层芯片附着到已经固定在基板上的芯片的底部，去除粘合箔，最后两个步骤是 重复直到所需数量的芯片堆叠在另一个之上。
-
公开(公告)号：US06558576B1
公开(公告)日：2003-05-06
申请号：US09646209
申请日：2000-11-22
IPC分类号： H01B120
CPC分类号： H05K3/321 , C09J9/02 , H05K1/0269 , H05K2203/124 , H05K2203/161
摘要： An electroconductive adhesive to which a luminescent heterocyclic compound, especially a benzoxazol, is added. The ratio of the heterocyclic compound in the adhesive, which preferably is a silver-charged, epoxy-resin adhesive, is 0.01% to 0.5% by weight. The adhesive is especially suitable for bonding electrical components to circuit carriers where automated process control is employed.
摘要翻译： 添加发光性杂环化合物，特别是苯并恶唑的导电性粘合剂。 粘合剂中的杂环化合物（优选为带负电荷的环氧树脂粘合剂）的比例为0.01重量％至0.5重量％。 粘合剂特别适用于将电气部件与使用自动化过程控制的电路载体相结合。
-
搜索结果
2 条记录 (耗时 0.022 秒)
