公开(公告)号：US06320747B1

公开(公告)日：2001-11-20

申请号：US09424810

申请日：2000-01-31

申请人： Hans-Peter Jahn ,  Stephan Ernst ,  Volker Brielmann

发明人： Hans-Peter Jahn ,  Stephan Ernst ,  Volker Brielmann

IPC分类号： H05K720

CPC分类号： H01L25/165 ,  H01L21/67126 ,  H01L23/24 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4921 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method is described for producing electric modules, where a power module is attached to a fastening part with an adhesive, with the adhesive first being precured in an edge area, and in another step the power module is encased in a gel. In another step, the gel and the adhesive are fully cured together in one step. This method is cost- and time-optimized for producing a compact electric module with power modules that have a high power loss and are exposed to high mechanical stresses.

摘要翻译： 描述了一种制造电气模块的方法，其中功率模块通过粘合剂附接到紧固部件，粘合剂首先在边缘区域中被预先固化，并且在另一步骤中，功率模块被封装在凝胶中。 在另一个步骤中，凝胶和粘合剂在一个步骤中完全固化在一起。 这种方法是成本和时间优化的，用于生产具有功率损耗高且暴露于高机械应力的功率模块的紧凑型电气模块。

公开(公告)号：US6040204A

公开(公告)日：2000-03-21

申请号：US143309

申请日：1998-08-28

申请人： Werner Herden ,  Johann Konrad ,  Hans-Peter Jahn ,  Martin Knapp ,  Hans-Peter Fuessl ,  Ning Qu

发明人： Werner Herden ,  Johann Konrad ,  Hans-Peter Jahn ,  Martin Knapp ,  Hans-Peter Fuessl ,  Ning Qu

IPC分类号： H01L25/07 ,  H01L21/98 ,  H01L27/00 ,  H01L29/866 ,  H01L23/10

CPC分类号： H01L25/50 ,  H01L2924/0002

摘要： A method for manufacturing chip stacks in which wafers are stacked one on top of the other. The wafer is provided with an adhesive foil on its bottom, and is subsequently cut into chips so that the adhesive foil remains intact and the chips adhering to the adhesive foil are stacked one on top of the other. A first layer of chips is reversibly attached to a baseplate, the adhesive foil is removed, the next layer of chips is attached to the bottom side of the chips already fastened to the baseplate, the adhesive foil is removed, and the last two steps are repeated until the desired number of chips is stacked one on top of the other.

摘要翻译： 一种制造芯片堆叠的方法，其中晶片彼此层叠。 晶片在其底部设置有粘合剂箔，随后被切割成芯片，使得粘合箔保持完整，并且粘附到粘合剂箔的芯片一个堆叠在另一个之上。 第一层芯片可逆地连接到基板上，去除粘合箔，下一层芯片附着到已经固定在基板上的芯片的底部，去除粘合箔，最后两个步骤是 重复直到所需数量的芯片堆叠在另一个之上。