公开(公告)号：US20230284388A1

公开(公告)日：2023-09-07

申请号：US17687890

申请日：2022-03-07

Applicant: Western Digital Technologies, Inc.

Inventor： Joyce Chen ,  Lynn Lin ,  Emma Wang ,  Linda Huang ,  Cong Zhang ,  Zengyu Zhou ,  Juan Zhou

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/10636 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: A surface mount device having features on contacts to prevent the surface mount device from tombstoning. The feature may be channel defined by the contact that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process. The feature may also be a solder mask that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process.

公开(公告)号：US11917761B2

公开(公告)日：2024-02-27

申请号：US17687890

申请日：2022-03-07

Applicant: Western Digital Technologies, Inc.

Inventor： Joyce Chen ,  Lynn Lin ,  Emma Wang ,  Linda Huang ,  Cong Zhang ,  Zengyu Zhou ,  Juan Zhou

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10636

Abstract: A surface mount device having features on contacts to prevent the surface mount device from tombstoning. The feature may be channel defined by the contact that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process. The feature may also be a solder mask that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process.