摘要:
A centrifuge (10) including a first rotatable mechanism (60) having a rotation axis with a fluid retentive housing (20) being coaxially mounted on the first rotatable mechanism for co-rotation therewith; a second rotatable mechanism (90) having a rotation axis with the first and second rotatable mechanisms being coaxially interconnected for co-rotation around a common axis; and fluid tubing (70) connected to the axis of the fluid retentive housing and having a distal length that extends axially outwardly from the fluid retentive housing. A support arm (50) is mounted to the second rotatable mechanism, a support tube (80) receives therethrough at least a part of the distal length of the fluid tubing, and a bearing member (82) rotatably supports the support tube in the support arm, whereby upon rotation of the first and second rotatable mechanisms, the fluid tubing is free to one of rotate with and rotate relative to the support tube.
摘要:
A process for nucleating and growing oxygen precipitates in a silicon wafer, including subjecting a wafer having a non-uniform concentration of crystal lattice vacancies with the concentration of vacancies in the bulk layer being greater than the concentration of vacancies in the surface layer to a non-isothermal heat treatment to form of a denuded zone in the surface layer and to cause the formation and stabilization of oxygen precipitates having an effective radial size 0.5 nm to 30 nm in the bulk layer. The process optionally includes subjecting the stabilized wafer to a high temperature thermal process (e.g. epitaxial deposition, rapid thermal oxidation, rapid thermal nitridation and etc.) at temperatures in the range of 1000 OC to 1275 OC without causing the dissolution of the stabilized oxygen precipitates.
摘要:
A heteroepitaxial semiconductor wafer includes a heteroepitaxial layer forming the front surface of the wafer that includes a secondary material having a different crystal structure than that of the wafer primary material. The heteroepitaxial layer is substantially free of defects. A surface layer includes the primary material and is free of the secondary material. The surface layer borders the heteroepitaxial layer. A bulk layer includes the primary material and is free of the secondary material. The bulk layer borders the surface layer and extends through the central plane. An SOI wafer and a method of making wafers is disclosed.