公开(公告)号：US5135556A

公开(公告)日：1992-08-04

申请号：US767614

申请日：1991-09-30

申请人： William B. Hornback ,  Wei H. Koh

发明人： William B. Hornback ,  Wei H. Koh

IPC分类号： H01L25/16 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4629 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/068

摘要： A fused high density multi-layered integrated circuit module for integrating infrared detector arrays to signal conditioning circuits is disclosed. The module comprises a plurality of thin film substrate layers disposed in substantially overlapping registry to form a non-conductive supporting body, a plurality of the layers have electronic devices mounted thereon. A plurality of detector element connectors are formed along a first edge portion of the body. Conductive conduits are formed upon a plurality of the layers. The conductive conduits have first portions which interconnect the detector element connectors to the electronic devices disposed upon the layers of the body. The conductive conduits also have second portions formed upon the surface of said layers and extending to the second edge portion thereof for communicating signals between the electronic devices and external electronics. A glass binding material adhesively attaches adjacent substrate layers together. The glass binding material has a coefficient of expansion of the substrate layers such that thermal stress is reduced and the need for a buffer board is consequently eliminated.

摘要翻译： 公开了一种用于将红外探测器阵列集成到信号调理电路的融合的高密度多层集成电路模块。 该模块包括设置在基本上重叠的配准器中的多个薄膜基底层，以形成非导电支撑体，多个层具有安装在其上的电子器件。 沿着身体的第一边缘部分形成多个检测器元件连接器。 导电导管形成在多个层上。 导电管道具有将检测器元件连接器与设置在主体层上的电子设备互连的第一部分。 导电导管还具有形成在所述层的表面上并延伸到其第二边缘部分的第二部分，用于在电子设备和外部电子器件之间传递信号。 玻璃粘合材料将相邻的基底层粘附在一起。 玻璃粘合材料具有基底层的膨胀系数，使得热应力降低，从而消除对缓冲板的需要。

公开(公告)号：US5128749A

公开(公告)日：1992-07-07

申请号：US681775

申请日：1991-04-08

申请人： William B. Hornback ,  Wei H. Koh

发明人： William B. Hornback ,  Wei H. Koh

IPC分类号： H01L25/16 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4629 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/068

摘要： A fused high density multi-layered integrated circuit module for integrating infrared detector arrays to signal conditioning circuits is disclosed. The module comprises a plurality of thin film substrate layers disposed in substantially overlapping registry to form a non-conductive supporting body, a plurality of the layers have electronic devices mounted thereon. A plurality of detector element connectors are formed along a first edge portion of the body. Conductive conduits are formed upon a plurality of the layers. The conductive conduits have first portions which interconnect the detector element connectors to the electronic devices disposed upon the layers of the body. The conductive conduits also have second portions formed upon the surface of said layers and extending to the second edge portion thereof for communicating signals between the electronic devices and external electronics. A glass binding material adhesively attaches adjacent substrate layers together. The glass binding material has a coefficient of expansion approximately equal to the coefficient of expansion of the substrate layers such that thermal stress is reduced and the need for a buffer board is consequently eliminated.

摘要翻译： 公开了一种用于将红外探测器阵列集成到信号调理电路的融合的高密度多层集成电路模块。 该模块包括设置在基本上重叠的配准器中的多个薄膜基底层，以形成非导电支撑体，多个层具有安装在其上的电子器件。 沿着身体的第一边缘部分形成多个检测器元件连接器。 导电导管形成在多个层上。 导电管道具有将检测器元件连接器与设置在主体层上的电子设备互连的第一部分。 导电导管还具有形成在所述层的表面上并延伸到其第二边缘部分的第二部分，用于在电子设备和外部电子器件之间传递信号。 玻璃粘合材料将相邻的基底层粘附在一起。 玻璃粘合材料的膨胀系数大致等于基底层的膨胀系数，使得热应力降低，从而消除对缓冲板的需要。

公开(公告)号：US06476392B1

公开(公告)日：2002-11-05

申请号：US09853819

申请日：2001-05-11

申请人： Charles S. Kaufman ,  Randolph S. Carson ,  William B. Hornback

发明人： Charles S. Kaufman ,  Randolph S. Carson ,  William B. Hornback

IPC分类号： G01J510

CPC分类号： H04N5/33 ,  G01J5/522 ,  H04N5/3655

摘要： A temperature dependent focal plane array operates without a temperature stabilization cooler and/or heater over a wide range of ambient temperatures. Gain, offset and/or bias correction tables are provided in a flash memory in memory pages indexed by the measured temperature of the focal plane array. The memory stores a calibration database, which is accessed using a logic circuit which generates a memory page address from a digitized temperature measurement of the focal plane array. The calibration database is comprised of an array of bias, gain and offset values for each pixel in the focal plane array for each potential operating temperature over the entire range of potential operating temperatures. The bias, gain and offset data within the database are read out, converted to analog form, and used by analog circuits to correct the focal plane array response.

摘要翻译： 温度依赖性焦平面阵列在宽的环境温度范围内没有温度稳定冷却器和/或加热器运行。 在由焦平面阵列的测量温度索引的存储器页面中的闪存中提供增益，偏移和/或偏置校正表。 存储器存储校准数据库，其使用从焦平面阵列的数字化温度测量生成存储器页地址的逻辑电路访问。 校准数据库包括在潜在工作温度的整个范围上的每个潜在工作温度的焦平面阵列中每个像素的偏置，增益和偏移值的阵列。 数据库中的偏置，增益和偏移量数据被读出，转换为模拟形式，并被模拟电路用于校正焦平面阵列响应。

公开(公告)号：US06891160B2

公开(公告)日：2005-05-10

申请号：US10281393

申请日：2002-10-25

申请人： Charles S. Kaufman ,  Randolph S. Carson ,  William B. Hornback

发明人： Charles S. Kaufman ,  Randolph S. Carson ,  William B. Hornback

IPC分类号： G01J5/52 ,  G01J5/10

CPC分类号： H04N5/33 ,  G01J5/522 ,  H04N5/3655

摘要： A temperature dependent focal plane array operates without a temperature stabilization cooler and/or heater over a wide range of ambient temperatures. Gain, offset and/or bias correction tables are provided in a flash memory in memory pages indexed by the measured temperature of the focal plane array. The memory stores a calibration database, which is accessed using a logic circuit which generates a memory page address from a digitized temperature measurement of the focal plane array. The calibration database is comprised of an array of bias, gain and offset values for each pixel in the focal plane array for each potential operating temperature over the entire range of potential operating temperatures. The bias, gain and offset data within the database are read out, converted to analog form, and used by analog circuits to correct the focal plane array response.

摘要翻译： 温度依赖性焦平面阵列在宽的环境温度范围内没有温度稳定冷却器和/或加热器运行。 在由焦平面阵列的测量温度索引的存储器页面中的闪存中提供增益，偏移和/或偏置校正表。 存储器存储校准数据库，其使用从焦平面阵列的数字化温度测量生成存储器页地址的逻辑电路访问。 校准数据库包括在潜在工作温度的整个范围上的每个潜在工作温度的焦平面阵列中每个像素的偏置，增益和偏移值的阵列。 数据库中的偏置，增益和偏移量数据被读出，转换为模拟形式，并被模拟电路用于校正焦平面阵列响应。

公开(公告)号：US6147389A

公开(公告)日：2000-11-14

申请号：US362507

申请日：1999-07-27

申请人： Jonathan Michael Stern ,  Itzhak Sapir ,  William B. Hornback

发明人： Jonathan Michael Stern ,  Itzhak Sapir ,  William B. Hornback

IPC分类号： H04N5/225 ,  H01L31/0203 ,  H01L23/56

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/16195

摘要： An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.

摘要翻译： 描述了提供相对于图像传感器的图像平面的参考平面的集成电路封装。 参考平面相对于传感器的图像平面对准，使得传感器可以快速，容易，准确且廉价地安装在光学组件中。 包装可以很薄，允许在改装应用中使用包装，例如在常规35毫米相机中使用封装的图像传感器。 该包装包括用于安装透明窗口的支架。 该包装包括定义参考平面的参考构件，例如导轨。 当传感器结合到包装中时，包装在传感器的参考平面和图像平面之间提供期望的公差。 窗口可以是平面的或配置为透镜，以将图像聚焦在图像平面上。 窗口可以被配置为使得其前（外）面成为封装图像传感器的图像平面。