摘要:
A heat sink assembly includes a CPU mounted on a socket connector (1) and a retention module (5). The retention module comprises a pair of metal frames (50), a pair of retaining claps (56) and a pair of stop bars (54) assembled together with the metal frames. Each frame defines a bottom wall (51), a first side wall (52) and a pair of second side walls (54). Each retaining clip has a hook (56c) formed at a top of the retaining clip for hooking a corresponding stop bar, and a clamping portion (56e) formed at a bottom of the retaining clip. The clamping portion and a free end of the hook together clamp a side portion (41a) of a heat sink assembled to the socket connector.
摘要:
An electrical socket for interconnecting an LGA chip with a PCB includes an insulative housing (2) and a multiplicity of terminals (1). The housing includes a plurality of passageways (26) extending therethrough for engagingly accommodating corresponding terminals. Each terminal includes a locating plate (10) arranged in rows, and a mating beam (12) connected to the locating plate and extending along the corresponding row. The terminals and the mating beams are arranged so that a projection A of each mating beam along the corresponding row is longer than a distance B between each two adjacent locating plates of two adjacent terminals arranged in the same row. Accordingly, when the mating beams are engaged with electrodes of the LGA chip, the mating beams are long enough to provide excellent resilient deflection characteristics, thereby ensuring good mechanical and electrical connection between the mating beams and the electrodes.
摘要:
A ZIF PGA socket includes a first housing and two second housings slidably received in the first housing. The second housings are simultaneously moved in the first housing by an actuator rod which is driven by a lever. The direction of movement of the second housing is substantially perpendicular to the direction of movement of the actuator rod.
摘要:
A ZIF PGA socket includes a first housing and at least one second housing slidably received in the first housing. The at least one second housing defines a plurality of passageways for retaining corresponding number of contacts therein. Each contact has a first portion fixed in the passageway, a second portion fixed to a printed circuit board and a third portion deformably connected between the first portion and the second portion. When the at least one second housing is moved with respect to the printed circuit board, the third portion of the contact deforms to absorb stress to the second portion of the contact.
摘要:
An electronic memory module socket is provided in which a memory module is easily insertable into and removable from the socket, and once inserted is locked into position for good mechanical retension of the module and proper electrical contact between socket contacts and module contacts. Locking-arms disposed at respective ends of the socket cooperate with openings in the memory module's circuit board to lock the module into the socket body. Detents are provided at respective ends of the socket body to additionally latch the module.
摘要:
A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier.
摘要:
An electrical socket for interconnecting an LGA chip with a PCB includes an insulative housing (2) and a multiplicity of terminals (1). The housing includes a plurality of passageways (26) extending therethrough for engagingly accommodating corresponding terminals. Each terminal includes a locating plate (10) arranged in rows, and a mating beam (12) connected to the locating plate and extending along the corresponding row. The terminals and the mating beams are arranged so that a projection A of each mating beam along the corresponding row is longer than a distance B between each two adjacent locating plates of two adjacent terminals arranged in the same row. Accordingly, when the mating beams are engaged with electrodes of the LGA chip, the mating beams are long enough to provide excellent resilient deflection characteristics, thereby ensuring good mechanical and electrical connection between the mating beams and the electrodes.
摘要:
A retainer device (1) for attaching a heat sink (30) to a CPU (40) includes a retention module (10) and a slider (20). The retention module has a non-symmetrical opening (12) in a side wall (14) thereof, thus defining a slanted surface (16) on the retention module. The slider defines a first slot (23) accommodating a flange (38) of the heat sink and the side wall of the retention module, and a second ramp slot (25) opposite to the first slot for accommodating the slanted surface of the retention module. A locking spring (27) is connected to the slider with a rotatable cam. The locking spring has a cantilever beam (28), and a pressing portion (29) pressing against the flange of the heat sink.
摘要:
An electrical LGA socket (1) includes an electrical connector portion (11) and an insulative frame portion (10) surrounding the connector portion. The frame portion comprises a stationary element (12) and a driver (14) pivotally assembled to the stationary element. The stationary element comprises an opening (124) for accommodating the connector portion, a Land Grid Package (LGP)(13) and, a heat sink (3) and, a protrusion (120). First and second aligned retainers (22, 24) located opposite to the protrusion and a pair of opposite sides (122) surrounding the opening. The protrusion secures a second flange (312) of the heat sink. The driver comprises a lever (16) rotatable between an open and closed positions, a shaft (18) pivotally assembled to the first and second retainers, and a follower (20) assembled to the shaft and rotatable together with the shaft in response to rotation of the lever. The follower depresses a first flange (311) of the heat sink.
摘要:
A driving mechanism is used for a socket which comprises a cover movably mounted on a base. The driving mechanism comprises a first reception space defined in the cover, a second reception space defined in the base and communicating with the first reception space, a driving cam having an upper portion rotatably retained in the first reception space of the cover and a lower portion rotatably and movably retained in the second reception space of the base. The upper portion of the driving cam is operative to rotate the lower portion of the driving cam in the second reception space which is subjected to reactive force from inner wall of the second reception space so that as the cam rotates it also moves linearly, thereby forcing the upper portion of the driving cam to pulling the cover to translate on the base.